台积电2nm，悄然量产

Core Viewpoint - TSMC has quietly announced the commencement of volume production of its N2 (2nm) process technology, achieving its goal set for Q4 2025 without a formal press release [1][5]. Group 1: N2 Technology Overview - The N2 process utilizes the first-generation nanosheet transistor technology, providing significant improvements in performance and power consumption [1]. - TSMC's N2 technology is expected to be the most advanced in the semiconductor industry in terms of density and energy efficiency, addressing the growing demand for energy-efficient computing [1]. - The N2 design aims for a 10%-15% performance increase at the same power level and a 25%-30% reduction in power consumption at the same performance level [3][4]. Group 2: Performance Metrics - For mixed designs including logic, analog, and SRAM, transistor density is expected to increase by 15% compared to N3E, while pure logic designs will see a 20% increase [3][4]. - The N2 process will feature a significant reduction in power consumption, with estimates ranging from 25% to 30% compared to N3E [4]. Group 3: Production and Capacity - TSMC has begun production of 2nm chips at its Fab 22 facility near Kaohsiung, Taiwan, with expectations for ramp-up in capacity driven by demand from smartphones and high-performance computing AI applications in 2026 [5][8]. - The company is constructing two new fabs capable of N2 technology to meet the strong interest from partners, with plans to produce N2P and A16 chips starting in late 2026 [8]. Group 4: Future Developments - TSMC plans to introduce N2P, an enhanced version of the N2 process, which will further improve performance and power efficiency, with volume production expected in the second half of 2026 [8]. - The A16 chip, designed for complex AI and HPC processors, will also begin production in the second half of 2026, utilizing TSMC's advanced Super Power Rail design [8].