TSMC(US:TSM) 半导体芯闻·2025-12-30 10:24Core Insights - The OECD report highlights the geographical distribution of wafer fabrication capacity, indicating that the top five economies (China, Taiwan, South Korea, Japan, and the USA) account for 87% of global wafer production capacity by September 2025 [2][5]. Geographical Distribution of Production Capacity - The report illustrates that South Korea's wafer production capacity is highly concentrated, with nearly 80% coming from nodes between 6nm and less than 22nm, primarily due to investments from major suppliers like SK Hynix and Samsung [5]. - In contrast, the USA's wafer production capacity is more diversified across various process nodes [5]. Concentration of Production Capacity Among Companies - The top ten semiconductor companies hold approximately 50% of the global wafer production capacity [6]. - In Japan, 73 companies operate wafer fabs with a total capacity exceeding 5 million wafers, with the top five companies accounting for 58% of Japan's total capacity [6]. Planned and Under Construction Capacity Growth - The majority of capacity investments are concentrated in the largest semiconductor-producing economies, driven by major companies operating in those regions [9]. - The USA, China, South Korea, Taiwan, Japan, Germany, and Singapore are identified as the countries with the largest growth in wafer production capacity [9]. Wafer Capacity by Chip Type - The report emphasizes that assessing wafer capacity distribution solely by node density is insufficient; chip type and business model must also be considered [11]. - China and Taiwan are the only two economies ranked among the top five producers for all six chip types analyzed [16]. Potential for Capacity Expansion by Chip Type - Capacity expansion potential varies significantly across chip types and economies, with notable growth in power chips and analog chips primarily occurring in China [18]. - The USA leads in upcoming capacity for analog chips, while China is set to dominate in mature logic chip production [19]. Mixed Manufacturing Capabilities of Fabs - Many fabs can produce multiple chip types, complicating the analysis of wafer capacity distribution [24]. - The presence of mixed-capacity fabs is particularly common in the production of analog and mature logic chips, while dedicated fabs are more prevalent for power semiconductors and advanced logic chips [26]. Average Wafer Fab Size by Chip Type - The average size of wafer fabs varies by chip type, with power, analog, and mature logic chips averaging between 30,000 to 50,000 WSPM, while advanced logic and general memory fabs are significantly larger [28]. Ownership and Wafer Capacity - Most wafer production capacity in the top five economies is owned by domestic companies, although foreign investment is increasing in some regions [32]. - The report notes that the ownership structure in the semiconductor industry can be complex, with many companies operating in multiple countries [33]. Wafer Capacity by Business Model - The report categorizes wafer capacity into three business models: IDM, pure foundry, and IDM-foundry, highlighting the evolving nature of semiconductor manufacturing [36]. - China and Taiwan are noted for having over 50% of their domestic wafer capacity coming from foundries rather than IDMs [38].