台积电的秘密武器

Core Viewpoint - TSMC controls advanced CoWoS packaging capacity, which is crucial for determining which AI chip manufacturers can scale production, making it a key player in the explosive growth of the AI market [1][2]. Group 1: TSMC's Role in AI Development - TSMC's CoWoS capacity is becoming increasingly critical for the survival and growth of other chip manufacturers and designers, as advanced packaging technology has become a new industry bottleneck [1]. - The rapid development of AI since 2023 has created trillions of dollars in market value, but supply chain bottlenecks, particularly in advanced manufacturing, are limiting growth [1][3]. - TSMC is a key factor in determining the speed and scale of AI development, with its capacity expansion plans aiming to double advanced wafer capacity by 2028 [4]. Group 2: Impact on Competitors - Google has reduced its 2026 TPU production target from 4 million to 3 million units due to limited access to TSMC's CoWoS technology, while NVIDIA has secured over half of TSMC's CoWoS capacity until 2027 [3]. - The shortage of CoWoS capacity may intensify competition, prompting other manufacturers like Intel to fill the gap and compete with TSMC in the foundry services sector [4][5]. - Companies like Google and Apple are exploring alternative solutions, such as Intel's EMIB packaging technology and engaging with Samsung's factories to meet their needs [4].