台积电的真正瓶颈

Core Viewpoint - TSMC's transition to 2nm GAA technology marks a significant advancement in semiconductor manufacturing, with expectations of increased production capacity and efficiency, while the real bottleneck lies in advanced packaging technologies like CoWoS, rather than transistor density [1][40]. Group 1: 2nm Technology and Production - TSMC's 2nm technology is set to begin mass production in Q4 2025, utilizing nanosheet transistors that enhance performance and power efficiency across all process nodes [1]. - Compared to the 3nm N3E process, the 2nm technology offers a 10% to 15% speed increase at the same power level, and a 25% to 30% reduction in power consumption while increasing chip density by over 15% [2]. - TSMC plans to establish five 2nm fabs in Kaohsiung, with a total investment exceeding NT$1.5 trillion, creating 7,000 high-tech jobs [2]. Group 2: Advanced Packaging Challenges - The CoWoS (Chip-on-Wafer-on-Substrate) technology is critical for integrating advanced chips with HBM memory; without it, even the most advanced chips could become excess inventory [3][40]. - Advanced packaging capabilities are becoming the key limiting factor in the AI semiconductor sector, overshadowing the importance of transistor density [40]. - TSMC's CEO confirmed that supply constraints are expected to persist until 2025, despite plans to double production capacity in 2024 and 2025 [21]. Group 3: Market Dynamics and Competitors - NVIDIA is projected to secure over 70% of the CoWoS-L capacity, creating a structural advantage, while companies like Broadcom are also vying for a share of the remaining capacity [23][40]. - The AI chip market is evolving, with companies like Broadcom capturing approximately 70% of the custom AI accelerator market, and their AI revenue expected to reach $12.2 billion in FY2024, a 220% year-over-year increase [32]. - The competition in the AI chip market is intensifying, with major players like AMD and Intel also making significant strides in developing their own AI hardware solutions [35][37]. Group 4: Future Developments and Innovations - TSMC is diversifying its advanced packaging technologies, including the development of CoPoS (Chip-on-Package-on-Substrate) technology, expected to be introduced after 2027 [24]. - The transition from FinFET to GAA technology introduces new manufacturing complexities, requiring specialized equipment and processes, which could extend production timelines [11][40]. - The demand for advanced packaging is expected to grow significantly, with OSAT (Outsourced Semiconductor Assembly and Test) companies also ramping up their capabilities to meet the increasing needs of AI chip production [43].