【招商电子】英伟达CES 2026跟踪报告：Vera Rubin已正式量产，展示全新Agentic和Physical AI平台

Core Viewpoint - NVIDIA's CEO Jensen Huang presented significant advancements in AI and computing technology at CES, highlighting the launch of the Vera Rubin chip and its applications in AI Agent and Physical AI [2][4]. Group 1: Vera Rubin Chip and Cabinet - The Vera Rubin chip has entered mass production, consisting of six types of chips, including Vera CPU with 227 billion transistors and support for 1.8 TB/s NVLink-C2C connections [2]. - The Rubin GPU features 336 billion transistors with HBM4 bandwidth reaching 22 TB/s, and single GPU NVLink interconnect bandwidth of 3.6 TB/s [2]. - The overall transistor count in the Rubin cabinet is 1.7 times higher than previous generations, with peak inference performance increasing by 5 times and training performance by 3.5 times [3]. Group 2: Design and Storage Enhancements - The Rubin computing board adopts a cable-free design, significantly improving assembly efficiency, reducing assembly time from 2 hours to 5 minutes [3]. - A new storage system, the NVIDIA Context Memory platform, has been introduced, featuring a separate rack that enhances cluster storage capacity and processing capabilities [3]. Group 3: Advancements in AI Technology - NVIDIA introduced the Alpamayo model, a 10 billion parameter visual-language-action model aimed at enhancing autonomous driving capabilities [4]. - The transition to Agentic AI represents a significant shift towards autonomous action, utilizing multi-model and multi-modal systems to create reasoning chains [4]. - The Physical AI platform integrates training, simulation, and inference processes, aiming to accelerate the deployment of Level 4 autonomous driving technology [4]. Group 4: Investment Recommendations - The CES showcase indicates a substantial upgrade in NVIDIA's VR platform, suggesting investment opportunities in the GPU sector and related hardware components [5]. - Attention is recommended for domestic computing power manufacturers and companies involved in advanced manufacturing, packaging, and HBM technologies [5].