TSMC(US:TSM) 半导体芯闻·2026-01-08 10:36Core Viewpoint - TSMC's advanced 3nm process is experiencing high demand, leading to a temporary halt in new project kick-offs for this technology, as existing capacity is fully utilized and cannot meet the influx of orders [2] Group 1: TSMC's 3nm Process - TSMC has raised prices for its 3nm process and has stopped new project kick-offs due to full order books and limited capacity [2] - The company is strategically encouraging clients to shift their product planning towards the 2nm process, which offers better cost structures and efficiency [2] - The 3nm family of products is currently filled with orders from AI GPUs, cloud data center ASICs, and high-end mobile processors [2] Group 2: Transition to 2nm Process - The 2nm process is seen as a critical turning point for TSMC, introducing nanosheet transistor architecture that significantly improves performance, power consumption, and density [3] - The introduction of atomic layer deposition (ALD) in the 2nm process does not significantly increase the number of EUV exposure layers, making the overall manufacturing cost more competitive compared to the 3nm process [3] - The GAAFET process represents a significant upgrade in wafer manufacturing, requiring advanced techniques to overcome challenges in material layering and etching [3]