Micron Technology(US:MU) TrendForce集邦·2026-01-19 09:02Core Insights - Micron Technology plans to acquire PSMC's facility in Taoyuan for $1.8 billion, establishing a long-term partnership for advanced DRAM packaging, which is expected to enhance Micron's advanced process DRAM capacity and improve PSMC's mature process DRAM supply, with global DRAM supply projected to increase by 2027 [2][3] Group 1: Micron's Acquisition and Capacity Expansion - The acquisition includes land and buildings, with Micron expected to gradually move existing and newly ordered equipment into the facility from 2026 to 2027, focusing on advanced process DRAM front-end equipment, with production expected to start in 2027 [3] - The first phase of the Taoyuan facility is anticipated to contribute over 10% of Micron's global capacity in Q4 2026 [3] Group 2: Market Position and Strategic Moves - In Q3 2025, Micron held a 25.7% revenue market share in the global DRAM industry, ranking third, and is actively acquiring facilities to shorten capacity construction timelines [4] - Prior to the Taoyuan acquisition, Micron had already acquired two AUO facilities in Tainan, an AUO facility in Taichung, and a Glorytek facility in Taichung for various purposes including wafer probing and HBM TSV [4] Group 3: Implications for PSMC - PSMC's existing DRAM capacity primarily uses 25nm and 38nm processes, limiting its DDR4 product line to smaller capacities; however, a collaboration with Micron is expected to allow PSMC to gain authorization for 1Y nm process within a year, potentially leading to further authorization for 1Z nm process [5] - This collaboration will enhance PSMC's competitiveness in the consumer DRAM market while expanding output without competing directly with Micron's advanced product lines [5]