英特尔谈先进封装的机遇

Core Viewpoint - Intel's foundry business is progressing steadily, with expectations of generating "billions of dollars" in revenue from chip and advanced packaging orders, despite slow progress in balancing consumer and data center/AI segments [2][5]. Group 1: Foundry Business Progress - CEO Lip-Bu Tan highlighted advancements in process nodes and customer sampling, particularly with the 18A process, which is now shipping initial products based on Intel's most advanced semiconductor technology developed and manufactured in the U.S. [2] - Intel is competing with TSMC's N3 process, with potential customers like Apple showing interest in Intel's foundry services, although Intel's ability to scale production depends on securing sufficient capital expenditure [2][5]. - CFO David Zinsner indicated that capital spending for the 14A process will be unlocked once customer commitments are confirmed, with expected order commitments likely in the second half of this year and the first half of next year [2][5]. Group 2: Advanced Packaging Developments - Intel's advanced packaging business is seen as a significant growth area, with EMIB and Foveros technologies being recognized as promising solutions by high-performance computing customers [5][6]. - Orders for advanced packaging are projected to exceed "1 billion dollars," which is crucial for reducing operational losses in the foundry business and achieving breakeven [8]. - The willingness of customers to prepay production costs indicates strong demand for Intel's EMIB and EMIB-T technologies, showcasing a commitment to collaboration [6][8].