印度芯片，究竟如何？

Core Viewpoint - The Indian government is making significant investments in semiconductor manufacturing projects across various states, with a total expected investment of approximately 1.6 trillion rupees in ten approved projects, including two wafer fabs and eight packaging facilities [11]. Group 1: Major Semiconductor Projects - Micron Technology is investing 225.16 billion rupees to build a semiconductor manufacturing plant in Gujarat, which will have an assembly and testing capacity for DRAM and NAND products, with a weekly output of approximately 14 million units [2]. - Tata Electronics Limited (TEPL) is investing 915.26 billion rupees in a semiconductor manufacturing plant in Gujarat, in collaboration with Taiwan's PSMC, with a monthly capacity of about 50,000 wafers [3]. - TEPL is also investing 271.2 billion rupees in Assam to establish a semiconductor manufacturing facility that will utilize local packaging technology, with a daily output of 48 million units [4]. - CG Power and Industrial Solutions Limited is investing 75.84 billion rupees in Gujarat to build a semiconductor manufacturing plant in partnership with Renesas Electronics America Inc. and STARS Microelectronic, with a daily output of approximately 15.07 million units [5]. - Kaynes Technology India Limited is investing 33.07 billion rupees in Gujarat to establish a semiconductor manufacturing plant for lead bonding interconnect and substrate packaging devices, with a daily output exceeding 6.33 million chips [6]. - Vama Sundari Investments is investing 37.06 billion rupees in Uttar Pradesh to build a semiconductor manufacturing plant for display driver ICs using gold bump technology, with a capacity of 20,000 wafers per month and up to 36 million chips [7]. - 3DGlass Solutions Inc. is investing 19.43 billion rupees in Odisha to establish a semiconductor manufacturing plant focused on packaging products, with a monthly capacity of approximately 5,800 glass panels and 4.2 million components [8]. - SiCSem Private Limited is investing 20.66 billion rupees in Odisha to build a semiconductor manufacturing plant in collaboration with Clas-SiC Wafer Fab Ltd. and Continental Device India Pvt. Ltd., with a monthly wafer capacity of 5,000 and packaging capacity of 8 million units [9]. - Continental Device India Private Limited (CDIL) is expanding its semiconductor manufacturing facility in Punjab with an investment of 1.17 billion rupees, producing high-power discrete semiconductor devices with an annual capacity of approximately 158.38 million units [10]. - Advanced System Packaging Technology Private Limited (ASIP) is investing 4.8 billion rupees in Andhra Pradesh to build a semiconductor manufacturing plant in collaboration with Korea's APACT, with an annual capacity of about 96 million units [11]. Group 2: Government Support and Initiatives - The Indian government has supported 24 chip design projects through startups, with 16 projects completing chip tape-outs and 13 projects receiving venture capital funding [11].