DFAC(SH:600006) 汽车商业评论·2026-02-14 23:04Core Viewpoint - The intelligent chassis market in China is projected to reach approximately 70 billion yuan by 2025 and exceed 100 billion yuan by 2030, driven by domestic substitution, AI empowerment, and user demand [4][5]. Market Overview - The intelligent chassis consists of three main subsystems: drive-by-wire braking, steer-by-wire, and active suspension, with the highest penetration rate in drive-by-wire braking at 80%. The penetration rate for active suspension is rapidly increasing, while steer-by-wire has a low penetration rate of only 5%, indicating significant growth potential [4]. - In the short term, the acceleration of drive-by-wire and integrated technologies is leading to rapid production and market penetration, particularly in mid-range vehicles, supported by local supply chain advantages [4][5]. - In the long term, advanced technologies such as fully active suspension, AI collaborative control, and skateboard chassis are reshaping the industry landscape, requiring continuous investment in core technological innovation and balancing cost, safety, and reliability [4][5]. Competitive Landscape - China has established the most complete intelligent chassis industry chain globally, with local suppliers achieving domestic substitution in areas like air suspension and drive-by-wire braking, particularly leading in air suspension [5]. - The collaboration between OEMs and technology companies is driving the evolution of chassis from "mechanical components" to "intelligent terminals" [5]. Industry Challenges - The industry faces the challenge of balancing short-term market demands with long-term technological innovation investments, as well as ensuring safety and reliability [5]. - The penetration of Electric Brake-by-Wire (EMB) technology is expected to be gradual due to technical difficulties, costs, and consumer perception, with significant challenges in achieving mass production [7][14][15]. Technological Trends - The integration of intelligent chassis technologies is expected to evolve through three levels: foundational structure, motion execution, and fusion control, which are essential for achieving a fully integrated intelligent chassis [7]. - The development of EMB is closely tied to high-level autonomous driving systems, indicating that EMB will likely be adopted in high-end models first due to cost considerations [14][32]. Ecosystem Collaboration - The future of the automotive ecosystem is expected to be characterized by parallel and compatible development between OEMs and component suppliers, with a focus on collaborative innovation and shared value creation [42][44]. - The industry is moving towards a model where OEMs define products while Tier 1 and Tier 0.5 suppliers implement and refine these products, emphasizing the importance of communication and collaboration in the development process [46]. Core Competitiveness - The core competitiveness of domestic chip companies lies in supply chain security and quality assurance, which are critical for the automotive industry [50]. - The challenges faced by domestic suppliers include the need for time to develop and validate new technologies, particularly in the context of rapidly evolving market demands [53].