Financial Data and Key Metrics Changes - Revenue for Q2 FY2026 was $9.9 million, down 27% from $13.5 million in the prior year period, primarily due to lower shipments of wafer packs [24] - Non-GAAP gross margin for Q2 was 29.8%, compared to 45.3% a year ago, reflecting lower sales volume and a less favorable product mix [25] - Non-GAAP net loss for the quarter was $1.3 million, or negative $0.04 per diluted share, compared to net income of $0.7 million, or $0.02 per diluted share in Q2 FY2025 [26] - Cash position improved to $31 million at the end of the quarter, up from $24.7 million at the end of Q1 [27] Business Line Data and Key Metrics Changes - Wafer-level burn-in engagements expanded with significant progress in production installations across AI processors, flash memory, and silicon photonics [5][6] - Package-part burn-in systems saw increased demand, with orders totaling more than $5.5 million in the fiscal third quarter to date, exceeding total orders for the entire second quarter [17] - Contact revenues, which include wafer packs and burn-in systems, totaled $3.4 million, representing 35% of total revenue, down from 64% in the same quarter last year [25] Market Data and Key Metrics Changes - The semiconductor test and burn-in market is experiencing growth driven by AI and data center infrastructure, with bookings expected to be between $60 million and $80 million in the second half of FY2026 [5][23] - The company is seeing strong demand for its Sonoma systems, particularly for high-temperature operating life qualifications for AI devices [17][19] - The silicon carbide market is expected to see demand growth, although the company is taking a conservative stance on order expectations [15] Company Strategy and Development Direction - The company is focusing on expanding into key markets such as AI processors, gallium nitride power semiconductors, and silicon photonics, diversifying its customer base and total addressable market [22] - A strategic partnership with ISE Labs was announced to enhance wafer-level test and burn-in services for next-generation high-performance computing and AI applications [8] - The company is reinstating financial guidance for FY2026, expecting revenue between $25 million and $30 million for the second half of the fiscal year [23][28] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in the outlook due to increased visibility across multiple end markets and the reinstatement of financial guidance [6][22] - The company highlighted the importance of reliability testing in the semiconductor industry, driven by the growing complexity and performance requirements of next-generation devices [21] - Management noted that the demand for AI and data center infrastructure is a significant growth driver for the company [4][20] Other Important Information - The company successfully closed the InCal facility and consolidated operations into its Fremont facility, resulting in cost savings [26] - The company raised $10 million in gross proceeds through an equity offering during the quarter [27] - The company plans to participate in several investor conferences in early 2026 to enhance investor relations [28] Q&A Session Questions and Answers Question: What is the potential booking strength of $60-$80 million in the second half of this fiscal year? - The majority of bookings are expected to come from the AI accelerator processor line, with some contributions from silicon carbide and silicon photonics [30] Question: Can you provide insight into the AI processor market's potential growth? - The company anticipates that the AI business could be measured in hundreds of millions of dollars in a few years, with significant demand for wafer-level burn-in systems [31][32] Question: What is the expected capacity for manufacturing wafer-level systems? - The company discussed the potential to manufacture over 20 systems a month if demand requires it, indicating strong production capabilities [36] Question: Will customers transition from package-part burn-in to wafer-level burn-in? - Customers may initially use package-part burn-in and later transition to wafer-level burn-in as they become more comfortable with the technology [50][51]