Core Viewpoint - The company has launched six new semiconductor equipment products, enhancing its capabilities in plasma etching, atomic layer deposition, and epitaxy, which supports its transformation into a high-end equipment platform company [1][4]. New Product Overview - The company introduced two new etching devices: the Primo UD-RIE for high aspect ratio etching and the Primo Menova for metal etching, both designed to improve efficiency and yield in semiconductor manufacturing [2][3]. - The Primo UD-RIE features advanced technologies such as a dynamic edge impedance adjustment system and a multi-zone temperature control system, enhancing etching precision and equipment reliability [2]. - The Primo Menova is specialized for metal etching, offering excellent etching uniformity and a high throughput, making it suitable for power semiconductors and advanced logic chips [2]. - Four new thin film deposition products were launched, including three atomic layer deposition devices and one epitaxy device, aimed at meeting the needs of advanced logic and storage devices [3][4]. - The Preforma Uniflash series for atomic layer deposition utilizes a dual-reactor design to achieve high production efficiency and excellent film uniformity [3]. - The PRIMIO Epita RP epitaxy device features a unique dual-chamber design, reducing production costs while maintaining high efficiency and adaptability for various semiconductor processes [4]. Impact on the Company - The introduction of these new products is expected to meet the increasing demand for advanced semiconductor technologies, thereby expanding the company's product offerings and enhancing its market position [4]. - The new product line is anticipated to positively influence the company's future growth in the semiconductor equipment market [4].

Core Viewpoint - The company has launched six new semiconductor equipment products, enhancing its capabilities in plasma etching, atomic layer deposition, and epitaxy, which supports its transformation into a high-end equipment platform company [2][6]. Group 1: Plasma Etching Technology - The company introduced two new products in the plasma etching sector, providing advanced and efficient solutions for high aspect ratio etching and metal etching [3]. - The new CCP capacitive high-energy plasma etching machine, PrimoUD-RIE®, features six single reaction chamber designs and offers higher ion bombardment energy, meeting stringent requirements for high aspect ratio etching while improving etching precision and production efficiency [3]. - Innovations in PrimoUD-RIE® include a dynamic edge impedance adjustment system that enhances the verticality of edge deep hole etching, significantly increasing the yield at the wafer edges [3]. Group 2: Metal Etching Equipment - The Primo Menova™ 12-inch ICP single-chamber etching equipment specializes in metal etching, particularly for Al lines and blocks, and is essential for the metallization process in wafer fabrication [4]. - This equipment excels in etching uniformity control, achieving high rates, high selectivity, and low substrate damage, while its efficient chamber cleaning process reduces contamination and extends operational time [4]. Group 3: Thin Film Deposition Technology - The company launched four new products in thin film deposition, including three atomic layer deposition products and one epitaxy product [5]. - The PreformaUniflash® metal gate series, which includes TiN, TiAl, and TaN products, meets the application needs for advanced logic and storage devices [5]. - This series features a unique dual reaction chamber design that allows for flexible configuration and achieves industry-leading production efficiency, along with advanced capabilities in film uniformity and contaminant control [5]. Group 4: Epitaxy Equipment - The PRIMIOEpita®RP, a dual-chamber reduced pressure epitaxy device, is noted for its compact design and flexibility, allowing for up to six reaction chambers [6]. - This equipment significantly reduces production costs and chemical consumption while maintaining high production efficiency, with advanced gas control and temperature regulation capabilities [6]. - The device is adaptable for various epitaxy processes across different semiconductor technologies, supporting the industry's shift towards more advanced nodes [6].