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颀中科技:显示芯片封测业务第三季度需求快速拉升
Xin Lang Cai Jing· 2025-09-25 08:30
Core Viewpoint - The company anticipates significant growth in its display chip packaging and testing business, driven by industry shifts and government subsidies, with a particularly strong demand expected in the second half of 2025 [1] Group 1: Display Chip Packaging and Testing - The transfer effect in the display industry is expected to continue, especially for large-size COF and TDDI COG products [1] - Rapid demand increase is anticipated in the third quarter, with further growth expected in the fourth quarter [1] - The penetration rate of AMOLED technology continues to rise [1] Group 2: Non-Display Chip Packaging and Testing - Cu bump packaging is projected to see incremental growth quarter by quarter in the second half of 2025 [1] - Although the DPS segment is expected to have low utilization rates in the first half of 2025, a recovery is anticipated in the second half [1] - The overall outlook remains cautiously optimistic [1]