Core Insights - The article emphasizes the critical role of heat dissipation technology in high-power, high-density electronic devices, highlighting the shift from traditional materials to diamond-copper composite materials as a solution to thermal management challenges [1][3][4]. Group 1: Heat Dissipation Technology - Heat dissipation has evolved from a performance optimization aspect to a core constraint on product performance, with traditional materials failing at heat flux densities exceeding 300 W/cm² [4][11]. - The performance gap between theoretical heat transfer rates of heat pipes and their practical applications presents opportunities for new materials [7][11]. - The economic implications of heat management are underscored by data indicating that a 10°C increase in temperature can reduce reliability by 50% [13]. Group 2: Market Dynamics and Applications - The demand for high-performance heat dissipation solutions is driven by sectors such as AI chips, electric vehicles, and 5G base stations, with significant increases in power consumption and heat flux densities [10][12]. - The global market for diamond-copper composites is projected to grow from $1.4 billion in 2024 to over $3.85 billion by 2031, with a compound annual growth rate (CAGR) of 12.4% [36][37]. - The Chinese market is expected to expand from 12.8 billion yuan in 2024 to 50 billion yuan by 2030, driven by domestic substitution and application expansion [37][38]. Group 3: Competitive Landscape - The competitive landscape is characterized by international giants dominating high-end markets while domestic companies accelerate local substitution, with Japan's Sumitomo Electric holding a significant market share [45]. - Domestic manufacturers are leveraging interface metallization techniques to achieve stable thermal conductivity rates of 600-800 W/(m·K) at lower costs compared to imports [45]. Group 4: Future Trends and Challenges - The industry faces challenges in scaling up from laboratory breakthroughs to commercial viability, with key barriers including high production costs and the need for advanced manufacturing techniques [31][29]. - Future developments are expected to focus on multi-process integration and the adaptation of materials for both high-end aerospace applications and consumer electronics [53][54].