1.【我国首台第四代百万千瓦商用快堆完成初步设计】先进核能产业发展座谈会7月22日在福州举 行。座谈会上，中核集团宣布，我国首台第四代百万千瓦商用快堆CFR1000完成初步设计。中核集 团副总工程师郑砚国介绍，我国首台百万千瓦商用快堆全面体现第四代核能系统对于安全性、可持续 性和经济性的要求， 装机容量将达到120万千瓦。（新华社） 2.【 优必选推出面向智能制造场景的全尺寸工业人形机器Walker S2】7月 23日消息，优必选推出面 向智能制造场景的全尺寸工业人形机器人Walker S2，通过迭代的群脑网络2.0（BrainNet 2.0）， 搭载自研的专用于工业人形机器人本体的智能体技术Co-Agent，构建工业级人形机器人AI双循环， 实现人形机器人单机自主和群体协同的螺旋式进化。（科创板日报） 3.【 尼康推出无掩模后道光刻机 】7月23日消息，尼康近日宣布，正式推出全球首款专为半导体后 道工艺设计的无掩模光刻系统DSP-100，并启动全球预订，预计于2026年3月31日前正式上市。该 设备采用SLM（空间光调制器）技术，专为扇出型面板级封装（FOPLP）领域设计，能够支持最大 600mm见方的大型 ...

Core Viewpoint - The article discusses the limitations and challenges of interposer line lengths in advanced packaging, highlighting the differences between electrical and optical interposers and the implications for signal integrity and transmission efficiency [1][11]. Group 1: Interposer Types and Challenges - There are two main types of interposers in production: organic interposers (RDL) and silicon interposers, with organic interposers being significantly cheaper to produce but having larger feature sizes [2]. - The use of silicon does not necessitate narrow lines, as wider signal lines require more signal layers, which is undesirable for manufacturers [2][3]. - The resistance of narrow lines in organic interposers leads to significant insertion loss, which is a major concern for clients [3][5]. Group 2: Signal Integrity and Grounding - Signal integrity is heavily reliant on good grounding, typically provided by ground layers, which can serve multiple functions including power delivery and impedance control [7]. - Controlled impedance is crucial for maintaining signal quality, and even short lines can suffer from interference or crosstalk [7][8]. - Designers strive to minimize loss and maintain grounding around high-speed lines, which can be challenging due to manufacturing constraints [8][10]. Group 3: Optical Interposers and Future Directions - Optical interposers face fewer limitations compared to electrical ones, as optical signals can transmit over longer distances [1][11]. - The integration of optical devices into packaging is a growing trend, with technologies like Lightmatter's Passage aiming to combine CMOS and silicon photonics within an interposer [11][12]. - While photonics offers a potential long-term solution to line length limitations, it is not yet ready for mass production [14].