Group 1 - The company plans to issue 52.5 million shares, accounting for 12.01% of the total shares after the issuance [1] - The strategic placement plan will participate in the subscription of up to 5.25 million shares, with a total subscription amount not exceeding 60 million yuan [1] - The initial inquiry date for the issuance is set for October 10, 2025, and the subscription date is October 15, 2025 [1] Group 2 - The company's net profit attributable to the parent company for 2022, 2023, and 2024 is projected to be 141 million yuan, 266 million yuan, and 276 million yuan respectively [2] - The company's main business revenue for 2024 is expected to be 3.945 billion yuan, ranking 41st among global PCB manufacturers with a market share of 0.75% [2] - The funds raised from the issuance will be invested in the second phase of high-layer and HDI projects, supplementing working capital, and repaying bank loans [2]