Core Viewpoint - Lightmatter has launched two silicon photonic interconnect products to meet the increasing bandwidth demands of AI deployments, specifically targeting high-bandwidth multi-chip switches for XPU applications [1][2]. Group 1: Product Overview - The first product, Passage M1000, is an optical intermediary layer designed to facilitate high-bandwidth communication between stacked ASIC or GPU chips, with a total bandwidth capacity of up to 14.25 TB/s [2]. - The M1000 utilizes 56 Gb/s NRZ modulation and wavelength division multiplexing, allowing each fiber to support eight wavelengths, resulting in a bandwidth of 56 GB/s per fiber [2]. - Lightmatter plans to release a pair of smaller co-packaged optical designs in 2026 following the M1000 launch [2]. Group 2: Additional Products - The Passage L200 and L200X are designed as more traditional co-packaged optical devices, promising bidirectional bandwidths of 32 Tb/s and 64 Tb/s, respectively [3]. - The L200 uses 56 Gb/s NRZ, while the L200X employs 112 Gb/s PAM4 SerDes, with both series utilizing a 3D packaging method to support external communication speeds exceeding 200 Tb/s [3]. - These chips incorporate various technologies from Alphawave Semi, including low-power, low-latency UCIe and optical-ready SerDes [3].