绝缘导热型覆铜板
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天和防务:公司“秦膜”系列材料主要面向面板级芯片封装和绝缘导热型覆铜板等领域
Zheng Quan Ri Bao· 2025-10-10 11:10
Core Viewpoint - Tianhe Defense is focusing on its "Qinmo" series materials for panel-level chip packaging and insulated thermal conductive copper-clad boards, while its subsidiary Chengdu Tongliang is the main platform for its RF chip business [2]. Group 1: Company Overview - The "Qinmo" series materials are primarily targeted at panel-level chip packaging and insulated thermal conductive copper-clad boards [2]. - Chengdu Tongliang's product offerings include four main categories: high-reliability RF transceiver front-end chips/modules for base stations, wireless communication RF transceiver chips/modules, radar perception chips/modules, and customized equipment products [2]. Group 2: Product Details - Specific products from Chengdu Tongliang include low-noise amplifiers, driver amplifiers, power amplifiers, switches, low-noise switches, RF front-end modules, and radar perception chips/modules [2].