Core Viewpoint - The company reported strong financial performance for the fiscal year 2025, with significant growth in revenue and net profit, driven by advancements in ultrasonic technology and increased market demand in key sectors such as new energy batteries and semiconductors [2][4]. Financial Performance - The company achieved total revenue of 774.01 million yuan, a year-on-year increase of 32.41% [3]. - Net profit attributable to the parent company was 114.92 million yuan, up 33.83% from the previous year [3]. - The net profit excluding non-recurring gains and losses was 92.32 million yuan, reflecting a substantial increase of 132.5% [3]. - Basic earnings per share rose by 34.21% to 1.02 yuan [3]. - Total assets at the end of 2025 reached 2.37 billion yuan, an increase of 11.54% compared to the beginning of the year [3]. - Shareholder equity attributable to the parent company grew by 6.36% to 1.80 billion yuan [3]. Business Growth Drivers - The company focused on the research, design, production, and sales of ultrasonic equipment, enhancing its core competitiveness through continuous technological innovation and process optimization [2][4]. - Significant revenue growth was observed across core business segments, including new energy batteries, wire harness connectors, and semiconductors, due to rising demand in the downstream markets [4]. - The diversified business layout has effectively mitigated the impact of cyclical fluctuations in individual downstream industries, enhancing operational stability and risk resilience [4]. Product Development and Market Expansion - In the power ultrasonic sector, the company expanded its product offerings for various downstream applications, including lithium battery welding and semiconductor packaging [5]. - The company has developed a comprehensive product matrix for wire harness connectors, reinforcing its leading position in high-voltage harnesses while making technological breakthroughs in low-voltage harnesses [5]. - In the semiconductor field, the company has established a complete set of solutions covering key processes in power semiconductor packaging and advanced packaging, with successful orders for ultrasonic bonding machines and die attach machines [5][6]. Technological Advancements - The company’s ultrasonic scanning microscope has broken the long-standing reliance on imported high-end ultrasonic detection equipment, enabling internal defect detection in various components [6]. - The advanced ultrasonic scanning microscope developed for liquid cooling plate defect detection achieved batch sales, expanding the market application boundaries for the company's detection ultrasonic products [6]. Future Outlook - The company plans to continue leveraging its comprehensive ultrasonic technology platform to enrich its product matrix and steadily advance the application of ultrasonic equipment in the semiconductor advanced packaging sector [7].