Core Insights - Jiangsu Xinde Semiconductor has recently secured nearly 400 million yuan in a new round of financing, led by local institutions in Nanjing [1] - Established in September 2020, Xinde Semiconductor specializes in semiconductor packaging and testing, becoming a leading player in China's backend semiconductor processes [1] - The financing will primarily be used to accelerate the development and production of advanced packaging technologies, including SiP, FOWLP, and Chiplet-2.5D/3D [1] Company Overview - Xinde Semiconductor is recognized as the first domestic company to possess cutting-edge packaging technologies such as 2.5/3D, TGV, TMV, LPDDR memory, and optical sensing (CPO) [1] - The company has grown significantly over nearly five years, positioning itself as a leader in the semiconductor packaging industry in China [1] Industry Impact - The funding will enhance the company's capabilities in high-end packaging technology, contributing to the self-sufficiency of the semiconductor supply chain [1] - The focus on advanced packaging technologies is expected to strengthen the competitive edge of the domestic semiconductor industry [1]