公众号记得加星标⭐️，第一时间看推送不会错过。 近年来，随着芯片制程工艺不断向前演进，"摩尔定律"的迭代进度逐渐放缓。曾经依靠制程迭 代实现晶体管密度翻倍、性能提升的传统路径，如今受限于物理极限与成本激增的双重挑战， 单纯依赖制程突破的发展模式渐显乏力。 在此背景下，半导体行业开始积极探索"后摩尔时代"的破局方向，先进封装技术凭借独特价值迅速成 为业界焦点。尤其是随着AI芯片对超高算力、低延迟的迫切需求，以及Chiplet异构集成技术的兴 起，先进封装不再只是芯片的"保护壳"，更成为实现系统级性能跃升的关键载体。 与传统的封装技术相比，先进封装技术具有灵活性强、集成密度高、尺寸小、性能好等优势，主要包 括倒装芯片封装、晶圆级封装、系统级封装和2.5D、3D封装等技术。 据Yole Group预测，2030年全球先进封装市场规模将突破794亿美元，2024-2030年复合年增长率 （CAGR）达9.5%，AI与高性能计算需求成为拉动复苏的首要动能。市场潜力之下，行业厂商争相 布局，推动先进封装赛道成为驱动产业变革的新引擎。 代工三巨头，鏖战先进封装 在先进封装这一关键赛道，台积电、英特尔、三星等厂商作为先进封装 ...

（文章来源：证券日报） 证券日报网讯通富微电9月29日在互动平台回答投资者提问时表示，公司紧跟行业技术发展趋势，抓住 市场发展机遇，面向未来高附加值产品以及市场热点方向，立足长远，大力开发扇出型、圆片级、倒装 焊等封装技术并扩充其产能；此外，积极布局Chiplet、2D+等顶尖封装技术，形成了差异化竞争优势。 截至目前，公司暂无与英伟达的相关业务合作。 ...

Rutten Guillaume Marie Jean, the director, President, and CEO of NASDAQ:AMKR, sold 10,000 shares at $30 per share, indicating potential insights into the company's future performance.Amkor Technology completed the sale of $500 million in 5.875% senior notes due in 2033 and announced a full redemption of its 6.625% senior notes due in 2027, showcasing its strategic financial management.The company's stock is currently priced at $29.58, with a market capitalization of approximately $7.31 billion, reflecting i ...

格隆汇9月22日丨长电科技(600584.SH)在互动平台表示，长电科技针对高性能计算等场景推出了一站式 系统级封装解决方案，覆盖了计算，存储，电源及网络相关芯片的封装需求，可以支持多芯片异构、异 质集成，已构建多层次的封装与测试能力，满足多个应用领域。长电科技在工业自动化与智能终端领 域，已布局多项机器人相关封装项目并与机器人控制系统客户联合开发系统级封装方案，提升系统集成 度与可靠性。 ...

格隆汇9月22日丨长电科技(600584.SH)在互动平台表示，长电科技针对高性能计算等场景推出了一站式 系统级封装解决方案，覆盖了计算，存储，电源及网络相关芯片的封装需求，可以支持多芯片异构、异 质集成，已构建多层次的封装与测试能力，满足多个应用领域。长电科技在工业自动化与智能终端领 域，已布局多项机器人相关封装项目并与机器人控制系统客户联合开发系统级封装方案，提升系统集成 度与可靠性。 ...

每经AI快讯，9月18日，华天科技（002185）在互动平台表示，公司CPO封装技术关键单元工艺开发正 在进行之中。 ...

Core Points - Huatian Technology (002185) closed at 11.2 yuan on September 12, 2025, with a market capitalization of 36.167 billion yuan, reflecting a 0.99% increase from the previous trading day [1] - The company announced that its board of directors approved a proposal to conduct foreign exchange hedging activities, with a maximum scale of up to 238 million USD, valid for twelve months from the date of approval [1] - The board meeting had full participation from all 9 directors, with unanimous approval for the proposal [1] Financial Performance - The stock opened at 11.1 yuan, reached a high of 11.35 yuan, and a low of 11.01 yuan on the same day [1] - The trading volume for the day was 1.169 billion yuan, with a turnover rate of 3.23% [1] Corporate Governance - The board meeting was conducted via telecommunication and complied with the Company Law and Articles of Association [1] - The proposal for foreign exchange hedging was reviewed and approved by the board's audit committee prior to the board meeting [1]

Core Viewpoint - The article discusses the current state and future potential of Panel Level Packaging (PLP) technology in China, highlighting its market size, key players, and the anticipated growth in the industry [2][3][4]. Market Overview - The existing market size for PLP in China is estimated at 38 million USD, accounting for 20% of the global PLP market, with expectations to exceed 100 million USD by 2028 [2]. - The PLP technology is still in the trial-and-error phase, with major companies expressing high expectations for its future applications in storage and computing chip packaging [2]. Key Players - Major global players in the PLP market include Samsung Electronics, ASE Group, STMicroelectronics, Powertech Technology, Hefei Silan Microelectronics, and Chongqing Silan Microelectronics [2]. - Domestic companies like Silan Microelectronics and Yicheng Technology are emerging as significant competitors, with Silan Microelectronics ranking among the top two in market share for power semiconductor PLP solutions [3]. Technological Development - The article emphasizes that domestic companies are accelerating the development of PLP platforms, preparing for a new technological iteration cycle in the packaging industry over the next 2-3 years [4]. - The focus of the upcoming conference will be on advanced packaging technologies, including multi-material heterogeneous integration and optical-electrical co-packaging [6]. Upcoming Events - TrendBank is organizing the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, aimed at fostering collaboration and innovation in the advanced electronic information industry [5][6].

Core Viewpoint - The initiation of a new large-scale financing round by Xi Zhong Technology (688352) shortly after its IPO signals potential issues in capital planning or unforeseen operational challenges [5][6]. Financing Overview - Xi Zhong Technology completed its IPO in April 2023, raising a net amount of RMB 2.233 billion, while the current convertible bond issuance aims to raise up to RMB 850 million [5]. Project Overlap and Efficiency Concerns - There are overlaps between new and old fundraising projects, raising questions about "duplicate investment." The company claims technical differentiation to avoid this criticism, but the argument lacks convincing power due to the commonality of downstream capacities [6][7]. - The previous IPO funds were allocated for "Gold Bumping" capacity, while the current project focuses on expanding "CuNiAu Bumping" capacity, which the company argues is not a duplicate investment [6]. Execution Risks in New Technology Investments - The "Advanced Power and Flip Chip Packaging Technology Transformation Project" is framed as a routine capacity expansion, but it is fundamentally a high-risk technology R&D investment that may have been underestimated in the prospectus [8]. - The project involves processes that Xi Zhong Technology has not previously engaged in, introducing both technical and market risks [8]. Profitability Assumptions and Methodological Flaws - Xi Zhong Technology's explanation for declining gross margins in 2024 and Q1 2025 cites the "capacity ramp-up phase" at its Hefei plant, which is a reasonable manufacturing explanation [11]. - However, when estimating the profitability of the new project at the same location, the company uses historical data from its mature Suzhou plant, leading to a contradictory logic in its projections [11][12]. Anomalies in Non-Display Chip Testing Business - The financial data for Xi Zhong Technology's non-display chip testing business shows a decline in core process output while revenue increased, raising questions about the quality and sustainability of this growth [14]. - In 2023, the output of the core bumping process decreased from 144,300 units in 2022 to 141,000 units, yet total revenue from non-display chip testing rose from RMB 120 million to RMB 130 million [15]. Revenue Growth Explanations - The company has not provided clear explanations for the revenue growth despite declining output, which could be attributed to increased average selling prices, structural changes in service offerings, or aggressive revenue recognition policies [16].

Group 1 - The article discusses various companies involved in semiconductor materials and technologies, highlighting their roles in the industry [2][22][30] - It lists numerous companies and their respective stock codes, indicating their presence in the semiconductor market [22][30][51] - The focus is on the advancements in semiconductor manufacturing processes and the importance of EDA (Electronic Design Automation) tools in enhancing efficiency [4][10][16] Group 2 - The article emphasizes the significance of packaging materials and technologies in the semiconductor industry, showcasing various companies that specialize in these areas [22][33] - It mentions the growing demand for advanced packaging solutions as a response to the increasing complexity of semiconductor devices [33][36] - The article also highlights the role of automation and precision in semiconductor manufacturing, with several companies providing innovative solutions [30][31][36] Group 3 - The article outlines the trends in automotive chips, indicating a shift towards more advanced and efficient semiconductor solutions for the automotive sector [51][64] - It discusses the impact of electric vehicles and autonomous driving technologies on the demand for specialized chips [51][64] - The article notes the competitive landscape in the automotive semiconductor market, with various players vying for market share [51][64] Group 4 - The article covers the advancements in sensor technologies, particularly in MEMS (Micro-Electro-Mechanical Systems) and their applications across various industries [44][46] - It highlights the increasing integration of sensors in consumer electronics and automotive applications, driving growth in this segment [44][46] - The article also mentions key players in the sensor market and their contributions to technological advancements [44][46]