苏州晶方半导体科技股份有限公司2025 年半年度报告 公司代码：603005 公司简称：晶方科技 苏州晶方半导体科技股份有限公司 苏州晶方半导体科技股份有限公司2025 年半年度报告 重要提示 一、 本公司董事会、监事会及董事、监事、高级管理人员保证半年度报告内容的真实性、准确 性、完整性，不存在虚假记载、误导性陈述或重大遗漏，并承担个别和连带的法律责任。 二、 公司全体董事出席董事会会议。 三、 本半年度报告未经审计。 四、 公司负责人王蔚 、主管会计工作负责人段佳国及会计机构负责人（会计主管人员）段佳国 声明：保证半年度报告中财务报告的真实、准确、完整。 五、 董事会决议通过的本报告期利润分配预案或公积金转增股本预案 不适用 六、 前瞻性陈述的风险声明 √适用 □不适用 本报告中所涉及的未来计划、发展战略等前瞻性描述不构成公司对投资者的实质承诺，敬请 投资者注意投资风险。 七、 是否存在被控股股东及其他关联方非经营性占用资金情况 否 八、 是否存在违反规定决策程序对外提供担保的情况 否 九、 是否存在半数以上董事无法保证公司所披露半年度报告的真实性、准确性和完整性 否 十、 重大风险提示 公司已在本报告中 ...

8月22日，南茂科技(IMOS)开盘上涨2.43%，截至21:30，报15.62美元/股，成交4482.0美元，总市值5.68 亿美元。 财务数据显示，截至2024年12月31日，南茂科技收入总额226.96亿台币，同比增长6.27%；归母净利润 14.2亿台币，同比减少23.97%。 大事提醒： 8月12日，南茂科技将于(美东)盘前披露2025财年中报（数据来源于纳斯达克官网，预计披露日期为美 国当地时间，实际披露日期以公司公告为准）。 资料显示，南茂科技股份有限公司是在半导体封装测试领域中具领先地位的供应商。晶片半导体在新竹 科技园、新竹工业园区及台湾南部科技园均设有先进的设备,为广大客户提供组装及测试服务,客户包括 领先的无晶圆半导体公司、集成器件制造商及独立的半导体代工企业。 本文源自：金融界 作者：行情君 ...

长电科技 20250821 摘要 长电科技 2025 年上半年营收达 186.1 亿元，同比增长 20.1%，创历史 新高，二季度营收 92.7 亿元，同比增长 7.2%，为历史单季新高。产能 利用率显著提升，二季度平均达到 70%左右，部分产线接近满产，显示 出强劲的增长势头。 先进封装业务增长显著，2025 年上半年同比增长 22%，其中晶圆级封 装增速接近 30%。汽车板块收入同比增长 34%，工业类产品收入同比 增长 39%，运算类电子收入同比增长 72%，表明公司在多元化应用领 域取得进展。 存储业务收入同比增长超过 150%，营收占比接近中双位数，主要受益 于运算电子领域需求强劲。功率器件方面，通过技术创新，推动碳化硅 器件技术走向量产和市场应用，与国内外头部第三代半导体客户合作。 公司积极布局汽车电子，在上海临港建立新工厂，预计年底量产，服务 国内外大客户。中期目标是使汽车电子收入占公司总营收超过 20%，表 明公司对汽车电子市场的重视和投入。 Q&A 长电科技在 2025 年上半年的市场表现如何？ 2025 年上半年，全球半导体行业延续了结构性复苏的态势，人工智能和基础 设施的持续拉动使高端芯 ...

Core Viewpoint - Changdian Technology (SH 600584) reported a year-on-year increase in revenue for the first half of 2025, but a significant decline in net profit and earnings per share [2] Financial Performance - The company's operating revenue for the first half of 2025 was approximately 18.605 billion yuan, representing a year-on-year increase of 20.14% [2] - The net profit attributable to shareholders was approximately 471 million yuan, showing a year-on-year decrease of 23.98% [2] - Basic earnings per share were 0.26 yuan, down 25.71% compared to the previous year [2]

Group 1 - Huayou Cobalt achieved a revenue of 37.197 billion yuan in the first half of 2025, a year-on-year increase of 23.8%, with a net profit attributable to shareholders of 2.71 billion yuan, up 62.3% [5] - In Q2 2025, Huayou Cobalt's revenue reached 19.35 billion yuan, a year-on-year increase of 28.3% and a quarter-on-quarter increase of 8.5% [5] - The company reported a net profit of 1.46 billion yuan in Q2 2025, reflecting a year-on-year growth of 27% and a quarter-on-quarter growth of 16.5% [5] Group 2 - Sinopec Oilfield Service Company reported a total revenue of 37.05 billion yuan in H1 2025, a slight increase of 0.6% year-on-year, with a net profit of 490 million yuan, up 9.0% [6] - In Q2 2025, the company achieved a revenue of 19.2 billion yuan, a year-on-year increase of 4.99% and a quarter-on-quarter increase of 7.56% [6] - The net profit for Q2 2025 was 274 million yuan, showing a year-on-year decrease of 0.16% but a quarter-on-quarter increase of 25.44% [6] Group 3 - Keda Li reported steady growth in its main business, with a focus on becoming a platform company for robot components, particularly in precision processing and large-scale manufacturing [6] - The company is concentrating on its humanoid robot subsidiary, Kemon, which focuses on reducers and joint modules [6] Group 4 - Huatian Technology achieved a revenue of 7.78 billion yuan in H1 2025, a year-on-year increase of 15.81%, with a net profit of 226 million yuan, up 1.68% [7] - The semiconductor industry's recovery is expected to drive demand for the company's products, with anticipated accelerated performance in H2 2025 as capacity is gradually released [7] Group 5 - Xtep International reported a revenue increase of 7.1% and a net profit increase of 21.5% in H1 2025 [8] - The main brand and Saucony showed collaborative growth, with the main brand's revenue up 4.5% and professional sports revenue up 32.5% [8] - The company maintains its full-year guidance, expecting steady growth in the main brand's revenue and a 30-40% increase in Saucony's revenue [8] Group 6 - Aimeike reported a revenue of 1.3 billion yuan in H1 2025, a year-on-year decrease of 21.6%, with a net profit of 790 million yuan, down 29.6% [8] - The company experienced a decline in revenue and net profit in both Q1 and Q2 2025, with significant year-on-year decreases [8] Group 7 - Gilead Sciences-B reported a revenue of 0.01 billion yuan in H1 2025, with a net profit of -88 million yuan [8] - The company is fully transitioning to innovative drug research and development, with key clinical progress expected for its core metabolic disease treatment products by the end of this year to early next year [8]

Core Insights - Jiangsu Xinde Semiconductor has recently secured nearly 400 million yuan in a new round of financing, led by local institutions in Nanjing [1] - Established in September 2020, Xinde Semiconductor specializes in semiconductor packaging and testing, becoming a leading player in China's backend semiconductor processes [1] - The financing will primarily be used to accelerate the development and production of advanced packaging technologies, including SiP, FOWLP, and Chiplet-2.5D/3D [1] Company Overview - Xinde Semiconductor is recognized as the first domestic company to possess cutting-edge packaging technologies such as 2.5/3D, TGV, TMV, LPDDR memory, and optical sensing (CPO) [1] - The company has grown significantly over nearly five years, positioning itself as a leader in the semiconductor packaging industry in China [1] Industry Impact - The funding will enhance the company's capabilities in high-end packaging technology, contributing to the self-sufficiency of the semiconductor supply chain [1] - The focus on advanced packaging technologies is expected to strengthen the competitive edge of the domestic semiconductor industry [1]

Core Viewpoint - The article discusses how the city of Tianmen in Hubei province has successfully increased its birth rate through substantial financial incentives and supportive policies, highlighting the relationship between population issues and industrial development [2][3][16]. Group 1: Financial Incentives - Tianmen has implemented a significant annual subsidy of 3,600 yuan per child for families with children under three years old, amounting to at least 100 billion yuan annually [3][10]. - The city has allocated over 300 million yuan to encourage childbirth, with a one-time reward of 2,300 yuan for the second child and 3,300 yuan for the third child, along with monthly subsidies [10][11]. - Additional financial support includes housing subsidies of 60,000 yuan for families with a second child and 120,000 yuan for those with a third child, which can be combined with marriage registration subsidies [10][11]. Group 2: Supportive Environment - Tianmen has created a nurturing environment for childbirth, including waiving fees for non-invasive prenatal genetic screening and providing one-time subsidies for assisted reproductive technologies [12][13]. - The city has streamlined administrative processes for families, allowing them to obtain necessary documents without leaving the hospital and providing various incentives for mothers returning to work [13][14]. - The local government has prioritized childbirth as a key initiative, establishing a structured approach to encourage higher birth rates [14][15]. Group 3: Industrial and Economic Context - Despite the successful increase in birth rates, Tianmen faces challenges related to its economic structure, with a GDP of 78.5 billion yuan in 2024, lagging behind neighboring cities [16][17]. - The city's economy is heavily reliant on traditional agriculture, with a high percentage of the first industry, and lacks a diversified industrial base [16][17]. - New industries are slow to develop, with high-tech industries contributing less than 8% to the GDP, indicating a need for innovation and improved competitiveness [17][18]. Group 4: Regional and Investment Challenges - Tianmen's geographical location limits its integration into larger economic zones, affecting its ability to attract investment and develop industrial clusters [18][20]. - The city has not effectively utilized modern investment strategies, relying on traditional methods that may not align with current economic trends [20][22]. - Recommendations for improvement include enhancing traditional industries, focusing on emerging sectors, and optimizing investment strategies to better align with regional economic dynamics [22].

Core Viewpoint - The 9th China System-Level Packaging Conference (SiP China 2025) focuses on advanced packaging, Chiplet technology, and heterogeneous integration in the context of AI, highlighting the need for innovation in packaging solutions to meet the growing demands of AI computing power [2][28]. Group 1: Conference Overview - SiP China 2025 will take place from August 26-28, 2025, at the Shenzhen Convention Center [2]. - The main theme is "Intelligent Gathering of Chip Energy, Heterogeneous Interconnection - Innovation in Advanced Packaging and Chiplet Ecosystem in the AI Era" [2]. Group 2: Key Sessions and Topics - The main forum will cover macro trends and ecosystem building, featuring discussions on AI opportunities and challenges in advanced packaging [5][8]. - Notable speakers include industry leaders from companies like ASE, AT&S, and Siemens, discussing topics such as the trends in fan-out packaging and the integration of advanced packaging technologies [8][10][11]. Group 3: Technical Forums - Technical forums will focus on design innovation and application implementation, with sessions on testing and reliability solutions for micro-systems [15][18]. - Discussions will also include AI-driven Chiplet advanced packaging and the role of advanced packaging substrates in high-performance computing and AI applications [20][22]. Group 4: Participation and Sponsorship - The conference will feature participation from leading semiconductor companies and experts in AI chip design, emphasizing the importance of collaboration in advancing packaging technologies [28]. - Major sponsors include companies like DuPont, Ansys, and Heraeus, indicating strong industry support for the event [23][25].

Core Viewpoint - The semiconductor packaging industry is experiencing a shift from CoWoS technology to emerging alternatives like CoPoS and FOPLP due to the limitations and challenges faced by CoWoS, particularly in terms of complexity, cost, and capacity constraints [1][36]. Group 1: CoWoS Technology Challenges - CoWoS packaging technology has become a focal point in the industry but is now facing significant challenges such as high production costs, yield control issues, and electrical performance limitations [1][36]. - The increasing size of AI GPU chips and the number of HBM stacks have led to bottlenecks in CoWoS, particularly due to photomask size limitations [4][36]. - TSMC has acknowledged these challenges and is positioning CoPoS as the next-generation successor to CoWoS, aiming to gradually replace CoWoS-L through technological iterations [4][9]. Group 2: CoPoS Technology Development - CoPoS technology represents a significant evolution from CoWoS by replacing the silicon interposer with a panel-sized substrate, allowing for larger packaging sizes and improved area utilization [6][8]. - CoPoS aims to enhance overall computational performance by integrating more semiconductors within a single package, thus improving yield efficiency and reducing edge waste [6][8]. - TSMC plans to establish a pilot line for CoPoS technology by 2026, with mass production targeted for late 2028 to 2029, with NVIDIA as the first customer [9][36]. Group 3: FOPLP Technology Emergence - FOPLP is emerging as a potential major alternative to CoWoS, leveraging the advantages of fan-out wafer-level packaging while utilizing panel-level substrates for enhanced size and utilization [10][13]. - The FOPLP market is projected to grow significantly, with a compound annual growth rate of 32.5%, reaching approximately $221 million by 2028 [14][36]. - Major industry players like ASE, Samsung, and others are actively investing in FOPLP technology, with ASE planning to establish a production line in Kaohsiung and Samsung already having a foothold in the panel-level packaging sector [11][18][19]. Group 4: CoWoP Technology Introduction - NVIDIA has proposed CoWoP technology, which simplifies the traditional packaging structure by integrating the chip directly onto the PCB, potentially reducing costs and improving performance [25][30]. - CoWoP aims to enhance signal integrity and power delivery while reducing thermal issues, but it faces significant technical challenges related to PCB manufacturing capabilities [30][36]. - The transition to CoWoP is seen as a long-term project for NVIDIA, with potential benefits including reduced costs and improved performance, although short-term adoption remains uncertain due to existing dependencies on traditional packaging methods [33][35].

Group 1 - The company has indicated that its eSinC 2.5D packaging technology platform includes SiCS, FoCS, and BiCS, which are comparable to CoWoS technology [2] - The company does not possess CoWoP packaging technology [2]