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广东工业大学研发新材料给芯片“退烧”
Huan Qiu Wang Zi Xun· 2025-07-17 04:21
Group 1 - The core innovation is the development of high-frequency and thermal conductive graphene-doped polytetrafluoroethylene (GO-PTFE) material, which meets the high-frequency insulation and efficient heat dissipation requirements for chips, breaking the long-standing foreign monopoly [1][3][5] - The GO-PTFE material has been certified by several leading companies in the communication equipment manufacturing and high-end chip packaging industries, with cooperative orders exceeding 140 million yuan [1][5] - The research team, led by Dr. Zhen Zhiyong, has been working on this material since 2015, addressing the challenges posed by traditional PTFE materials that hinder heat dissipation despite their excellent insulation properties [3][5] Group 2 - The team aims to establish a fully independent intellectual property system for high-frequency thermal management materials, ensuring that China's core technology for chip thermal management is firmly in its own hands [5] - The successful development of GO-PTFE material took seven years, culminating in 2022, and led to the establishment of Guangzhou Sha Kui Technology Co., Ltd. for further research and testing [5] - The performance of the GO-PTFE material has been validated by testing reports from domestic industry leaders, confirming its excellent thermal conductivity, stable low dielectric constant, and high peel strength [5]