点击 最 下方 关注《材料汇》 ， 点击"在看"和" "并分享 添加 小编微信 ，遇见 志同道合 的你 特别福利 （欢迎加入 材料汇深海材料交流群，并记住加小编微信 ） 参考阅读 iPhone 17 Pro"弃钛从铝"：散热革命背后的VC均热管崛起（附投资逻辑） 破解"散热天花板"：金刚石铜复合材料的百亿征程（附分析报告） 近100家散热材料企业榜单：谁在为你的iPhone和AI服务器"降温"？ 正文 1 金刚石材料:性能优异的芯片散热材料 2 相关标的:沃尔德、四方达、国机精工 3 风险提示 证券研究报告 88 年安ich HUA AN SECURITIES 高性能高集成芯片散热问题亟待解决 在芯片集成度提升及尺寸微缩发展态势下，芯片功能及性能进一步提升强化，但芯片功耗及发热量提升，随服役温度上升半导体元 件失效率显著提升，散热问题影响芯片性能亟待解决。 ™ 永远 、电子技术等领域飞进发展,排射芯片,板种模块组电子设备向着微型化、多功能化、高功率密度方向发展。在民用领域， 部分芯片工作时产生的热流密皮高达150 Wom²，就或窗达中装千个阵元的功率密龙甚至,芯达101 Wom²。同时随着电子,吊钩 积的减小 ...

在 那 之 前 我 们 先 了 解 一 下 手 机 正 常 怎 么 散 热 的 。 过 去 几 年 ， 旗 舰 智 慧 型 手 机 普 遍 仰 赖 均 热 板 （Vapor Chamber）与石墨片等机身层级的被动散热方案，藉由扩大散热面积，将热能分散至机 身结构中。然而，随着高时脉CPU、庞大GPU 与NPU 同时运作成为常态，仅靠手机内部的被动 散热结构，已愈来愈难以支撑长时间高负载运算。 在此背景下，HPB 的出现，某种程度上也被视为移动装置散热零组件的下一种可能选项。 如果您希望可以时常见面，欢迎标星收藏哦~ 随 着 移 动 SoC 迈 入 2 纳 米 与 高 密 度 AI 运 算 时 代 ， 散 热 正 成 为 效 能 竞 赛 的 关 键 变 数 。 三 星 在 Exynos 2600 上导入Heat Pass Block（HPB），近期也传出该封装散热技术可能被其他Android 阵营芯片采用，是否未来HPB 将会成为未来手机的趋势呢？ 传统设计中，热量需先穿过封装材料，再由均热板或石墨片向外扩散；而HPB 的导入，则在裸晶 与外部散热系统之间建立更直接的热传路径，使热能能更快离开高温区域。 三星 ...

Group 1 - The core viewpoint of the article is that Zhongtai Co., Ltd. (300435) is focusing on the development and application of liquid cooling technology to enhance chip heat dissipation efficiency [1] Group 2 - The company will leverage its technological advantages in the heat exchanger field to concentrate on the liquid cooling sector [1] - The emphasis on liquid cooling is part of the company's strategy to improve performance in the semiconductor industry [1]

如果您希望可以时常见面，欢迎标星收藏哦~ 1月13日，记者从西安电子科技大学获悉：该校郝跃院士团队打破了20年的半导体材料技术瓶 颈，让芯片散热效率与综合性能得到了飞跃性提升，为解决各类半导体材料高质量集成提供了可 复制的中国范式。相关成果日前发表在国际顶级期刊《自然·通讯》和《科学·进展》上。 同时，该项突破让半导体器件性能大幅提升。基于这项创新技术，研究团队制备出的氮化镓微波 功率器件，单位面积功率较目前市面上最先进的同类型器件性能提升了30%到40%。"这意味着将 其使用在探测装备上，探测距离可以显著增加；将其使用在通信基站时，则能实现更远的信号覆 盖和更低的能耗。"团队成员、西安电子科技大学微电子学院教授周弘说。 对于普通民众，这项技术的红利也将逐步显现。"未来给手机用上这类芯片后，在偏远地区的信 号接收能力会更强，续航时间也可能更长。"周弘告诉记者，"我们也正在研究将金刚石这类散热 性能更强的材料用于半导体上。假如成功攻关，半导体器件的功率处理能力有望再提升一个数量 级，达到现在的十倍甚至更多。" （来源 ： 群众新闻、西安电子科技大学 ） *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传 ...

Summary of Diamond Heat Dissipation Report Industry Overview - The report focuses on the diamond materials industry, particularly their application in heat dissipation for semiconductor devices, especially AI chips. Diamond materials are recognized for their exceptional thermal conductivity, which is five times that of copper and ten times that of aluminum [1][2]. Key Points and Arguments - **Thermal Conductivity and Applications**: Diamond materials can significantly reduce chip junction temperatures, making them ideal for densely packed AI chips. They have been partially commercialized in applications such as RF power amplifiers and high-power laser diodes [1][3]. - **Cost and Commercialization Challenges**: Despite their advantages, the large-scale application of diamond in semiconductor devices faces challenges related to cost and connection processes. Current methods include indirect connections, with future directions aiming for direct integration with silicon chips [2][3]. - **Market Potential**: The AI chip market is projected to reach 400-500 billion RMB by 2030, with a global market size of approximately 3 trillion RMB. If diamond heat dissipation solutions achieve a penetration rate of 5%-50%, the market potential could range from 7.5 billion to 150 billion RMB [2][9]. - **Types of Diamond Materials**: Diamond materials are categorized into single crystal, polycrystalline, and composite materials (e.g., diamond-copper, diamond-aluminum). Polycrystalline diamonds are favored for their lower cost and faster production speed, while composite materials balance high thermal conductivity with good processability [4][5]. - **Specific Material Properties**: - Single crystal diamonds have thermal conductivities of 2000-2200 W/m·K, while polycrystalline diamonds range from 1000-1800 W/m·K [2][4]. - Diamond-aluminum has a lower density and is suitable for weight-sensitive applications, achieving thermal conductivities around 500 W/m·K [6]. - **Emerging Companies and Technologies**: Several companies are developing new heat dissipation materials, including a company that introduced a diamond-silicon carbide composite with a thermal conductivity exceeding 800 W/m·K, which is double that of copper [7][8]. Additional Important Content - **Performance Improvements**: Apache's diamond cooling technology can lower GPU hotspot temperatures by 10-20 degrees, reduce fan speeds by 50%, and enhance overclocking capabilities by 25%, leading to significant cost savings in data center cooling [2][3]. - **Future Development Directions**: The focus is shifting towards direct bonding techniques or epitaxial growth methods to integrate diamond layers directly with silicon chips, which could enhance performance and reliability [3][4]. - **Market Outlook**: The market for new heat dissipation solutions is expected to grow significantly, with potential revenues reaching thousands of billions of RMB, indicating a substantial opportunity compared to the current diamond cultivation industry [9].

Core Viewpoint - The Chinese government has announced export controls on industrial diamonds starting from November 8, 2025, which may create challenges for U.S. chip manufacturers due to potential raw material shortages and increased production costs [1][2]. Industry Overview - Diamonds are crucial in modern technology, particularly in supporting industries like 5G communication and artificial intelligence, due to their superior thermal conductivity, making them ideal for chip cooling [2]. - China is currently the largest diamond producer globally, with an annual output exceeding 22 million carats, providing a significant competitive advantage in the diamond industry [2]. Company Insights - The city of Zhecheng in Henan province has rapidly developed a complete diamond industry chain since overcoming technical bottlenecks in 2019, significantly enhancing both the quantity and quality of diamond production [4]. - The local high-end diamond brand "Zhe·Guang" has gained popularity, offering top-quality diamonds priced around 8,000 yuan per carat, attracting high-net-worth individuals and securing various orders [4][6]. Market Trends - Consumers are increasingly turning to Zhecheng diamonds for their affordability and quality, with reports of significant sales growth for the Zhe·Guang brand, which has surpassed seven-digit sales figures in the first half of the year [8]. - The rise of Zhecheng's diamond industry is seen as a challenge to the traditional dominance of Western diamond markets, providing consumers with more options and competitive pricing [6][10]. Future Outlook - The Chinese diamond industry is poised for robust growth, with both industrial and high-end jewelry diamonds gaining prominence in the global market, potentially disrupting the long-standing Western market dynamics [10]. - There is optimism that domestic brands like Zhe·Guang will continue to innovate and build their brand presence, establishing a strong foothold in the international diamond market [10].

Core Viewpoint - The article discusses the development and investment landscape of diamond-based composite materials, highlighting various companies involved in this sector and their technological advancements. Group 1: Company Overview - Changsha Shenghua Microelectronics Materials Co., Ltd. specializes in high-performance electronic packaging materials, including tungsten-copper and diamond-copper composites, with thermal conductivity reaching 600-800 W/m·K [5] - Nanjing Ruiwei New Materials Technology Co., Ltd. focuses on new materials for chip cooling, collaborating with Nanjing University of Aeronautics and Astronautics [6] - Hunan Xinfeng Advanced Materials, a subsidiary of Hunan Xinfeng Technology, is engaged in the research and production of diamond semiconductor materials, with a projected output of 50 tons in 2024 and 150 tons in 2025 [8] Group 2: Investment and Financing - Several companies have secured significant funding, such as Hunan Xinfeng Advanced Materials, which completed an A+ round of financing amounting to several million yuan in February 2025 [9] - Ningbo Saime Technology Co., Ltd. was established with investment from Jiangxi Copper Group, focusing on lightweight, high-thermal-conductivity composite materials for various applications [10] - Anhui Shangxin Crystal Technology Co., Ltd. has received angel round financing and is involved in the production of high-end refractory metals and diamond-copper composites [12] Group 3: Technological Advancements - Companies are developing advanced materials with high thermal conductivity, such as diamond-copper composites, which are essential for high-power semiconductor applications [33] - The industry is leveraging innovative manufacturing techniques, including chemical vapor deposition and powder metallurgy, to enhance material properties and production efficiency [24][25] - The market is witnessing a trend towards integrating diamond-based materials in various sectors, including aerospace, automotive, and electronics, due to their superior thermal management capabilities [42]

Summary of Key Points from the Conference Call Industry Overview - The diamond industry, particularly synthetic diamonds, is experiencing rapid growth due to their high thermal conductivity and electrical properties, making them ideal for high-power semiconductor cooling solutions, especially in the context of the fast-developing AI computing market. The market is expected to maintain double-digit growth in the coming years [1][2][6]. Market Dynamics - China has become the largest producer of synthetic diamonds globally, with Henan province accounting for over 90% of industrial single crystal production. The market size in China is projected to reach 5 billion yuan (approximately 0.7 billion USD) by 2024, continuing to grow at a double-digit rate into 2025 [1][6]. - The global market for diamond-copper heat dissipation components exceeds 2 billion USD, driven by demand in power semiconductors, lasers, and AI chips. These components offer significant performance advantages over traditional materials, with thermal conductivity ranging from 400 to 800 W/m·K [1][12]. Technological Advancements - Chemical Vapor Deposition (CVD) technology, particularly Microwave Plasma CVD (MPCVD), is central to the production of high-quality single crystal diamonds, facilitating a shift towards high-tech, high-profit industry segments. Henan aims to become a core cluster for semiconductor materials in Central and Western China [1][7][8]. - CVD technology allows for the production of large-sized single crystal diamonds with high purity and low defects, suitable for high-tech applications, including semiconductor substrates and high-end jewelry [1][11]. Competitive Landscape - Domestic and international companies are actively investing in diamond technology. U.S. companies have a technological lead through capital accumulation and partnerships with downstream tech firms, while Chinese companies are rapidly catching up by focusing on cost reduction and performance-price balance [3][18][21]. - The U.S. and Japan have established competitive advantages due to early entry into the market and high levels of independent research and development. In contrast, China is still developing its capabilities, primarily relying on high-temperature and high-pressure methods [21][22]. Challenges and Solutions - The technology sector faces challenges such as overheating of chips, accelerated aging of electronic components, and increased power consumption. Diamonds can effectively address these issues through superior thermal management capabilities [5]. - Although the production cost of large-sized diamonds remains high, advancements in bonding materials technology may help reduce costs and overcome technical bottlenecks [5]. Future Trends - The demand for functional synthetic diamonds is expected to grow at a double-digit rate, driven by advancements in smart manufacturing, new energy vehicles, and the photovoltaic industry [7]. - The market is gradually shifting towards high-end products, indicating significant potential for functional synthetic diamonds to drive rapid industry development [7]. Applications and Innovations - Huawei has made significant strides in utilizing diamond materials to reduce chip packaging thermal resistance by approximately 30%, showcasing the material's potential in enhancing electronic product performance [17]. - Diamond films, developed by researchers from Peking University and Hong Kong University, have potential applications in optical components, quantum technology, and high-end consumer electronics due to their lightweight and high thermal management capabilities [15]. Conclusion - The diamond industry is poised for substantial growth, driven by technological advancements and increasing demand across various sectors. The competitive landscape is evolving, with both domestic and international players striving to leverage diamond technology for enhanced performance in semiconductor applications [1][18][22].

Core Viewpoint - The company is currently developing diamond single crystal products for chip cooling applications, but has not yet achieved mass production [2] Group 1: Product Development - The company is conducting research and experiments on diamond single crystal products for chip cooling applications [2] - Mass production of these products has not yet been realized [2] Group 2: Market Impact - Changes in export control policies may extend the approval cycle for related products [2] - In the short term, some foreign trade customers may purchase products in advance [2] - The company does not plan to adjust product prices in the near future [2]

Core Viewpoint - The company is currently developing diamond single crystal products for chip cooling applications, but has not yet achieved mass production [1] Group 1: Product Development - The company is conducting research and experiments on diamond single crystal products for chip cooling applications [1] - Mass production of these products has not yet been realized [1] Group 2: Market Impact - Changes in export control policies may extend the approval cycle for related products [1] - In the short term, some foreign trade customers are expected to make advance purchases of the company's products [1] - The company does not plan to adjust product prices in the near future [1]