J P M O R G A N Asia Pacific Equity Research 22 December 2025 Electronic Components Sector Report on SEMICON Japan Advanced Package Substrates seminar At the 'APCS Technology Session: Advanced Package Substrates' held at SEMICON Japan on December 17, Ibiden stated that it expects the trend in advanced packaging toward larger and more multi-layered substrate packaging will continue as chiplets become more popular, and that strengthening warpage management will become even more important to maintain and impro ...