Core Viewpoint - The company Huada Jiutian (301269) has developed an advanced packaging EDA platform capable of supporting the design of high-end AI chips, GPUs, and high-performance processor chips, filling a gap in the domestic high-end 3DIC design tools market [1] Group 1 - The advanced packaging EDA platform is now capable of supporting Chiplet design for high-end AI chips and GPUs [1] - The company has established a comprehensive solution covering the entire process from heterogeneous integration to verification in the 3DIC design EDA field [1] - This development addresses the lack of high-end 3DIC design tools in the domestic market [1]