AI新平台散热技术

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捷邦科技(301326) - 301326捷邦科技投资者关系管理信息20250919
2025-09-19 09:46
Group 1: Technology Development - The company is developing microchannel liquid cooling plate (MLCP) technology, which is priced 3 to 5 times higher than existing cooling solutions to address high power consumption in AI platforms [2][3] - The MLCP technology is still in the early feasibility discussion stage, with no bulk production orders received yet [3] - The company has a competitive advantage in metal etching processes, which are superior in precision and flatness compared to 3D printing [3] Group 2: Business Strategy and Growth - The company plans to explore potential acquisition opportunities that align with its long-term strategic development while ensuring organic growth [4] - The company has established supplier codes with major clients in the consumer electronics sector, including Apple, Amazon, and Google, as well as in the new energy battery sector with companies like CATL and BYD [6] - The company aims to enhance its international competitiveness by leveraging existing industry resources and increasing investment in technological innovation and R&D [6] Group 3: Financial Performance and Reporting - The company is currently operating normally and will disclose its financial performance in accordance with regulatory requirements [6] - There is no significant undisclosed information related to the company's operations from the recent investor relations activity [6]