Core Viewpoint - The global semiconductor market for analog integrated circuits (ICs) is projected to reach $85 billion this year, with a compound annual growth rate (CAGR) of 10%, driven by advancements in artificial intelligence, IoT, and autonomous vehicles [1][2]. Group 1: Market Dynamics - The demand for analog ICs is increasing due to their ability to process continuous signals, essential for interacting with the physical environment [1]. - Companies like OKI and Nisshinbo Micro Devices are collaborating to develop thin-film analog ICs that can be vertically stacked, promoting miniaturization and cost reduction [1][3]. Group 2: Technology Development - The development of thin-film 3D analog ICs utilizes OKI's crystal film bonding (CFB) process, allowing for the separation and bonding of functional film layers [3]. - CFB technology enables thinner chips (5 to 10 micrometers) compared to traditional methods, which typically result in thicker chips (tens to hundreds of micrometers) [3]. Group 3: Signal Integrity and Performance - Signal interference and noise are challenges due to the thinness of stacked analog ICs, which is addressed by Nisshinbo's proprietary shielding technology [4][5]. - Shielding is strategically applied to critical areas to minimize signal interference without compromising circuit functionality [5]. Group 4: Chiplet Integration Advantages - The thin-film 3D analog ICs can facilitate the integration of analog and digital ICs, allowing for modular ICs that can create more complex devices [7]. - Smaller chips can be optimized for specific functions, reducing costs and space requirements, while improving manufacturing yield [7]. Group 5: Future Outlook - OKI and Nisshinbo are optimistic about overcoming manufacturing challenges and plan to commercialize their new methods, aiming for mass production by 2026 [9].