Company Overview - Proactive is a financial news publisher that provides fast, accessible, informative, and actionable business and finance news content to a global investment audience [2] - The company operates with a team of experienced and qualified news journalists across key finance and investing hubs including London, New York, Toronto, Vancouver, Sydney, and Perth [2] Market Focus - Proactive specializes in medium and small-cap markets while also covering blue-chip companies, commodities, and broader investment stories [3] - The content delivered by the company includes insights across various sectors such as biotech and pharma, mining and natural resources, battery metals, oil and gas, crypto, and emerging digital and EV technologies [3] Technology Adoption - Proactive is recognized for its forward-looking approach and enthusiastic adoption of technology to enhance workflows [4] - The company utilizes automation and software tools, including generative AI, while ensuring that all content is edited and authored by humans to maintain quality and best practices in content production [5]

Core Insights - The collaboration between Deca Technologies and Silicon Storage Technology (SST) aims to innovate a comprehensive non-volatile memory (NVM) chiplet package to enhance customer adoption of modular, multi-die systems [1][4] - This partnership combines Deca's M-Series™ fan-out and Adaptive Patterning technologies with SST's SuperFlash embedded flash technology, providing a bundled offering that enhances architectural flexibility and offers technical and commercial advantages over traditional monolithic integration [2][3] Company and Industry Overview - Chiplet technology is gaining traction in the semiconductor industry as it allows for more efficient and cost-effective product designs by enabling the combination of different chips, process nodes, and sizes [5] - The collaboration supports customers from early design through qualification and prototype manufacturing, aiming to streamline integration and accelerate design cycles for broader adoption of heterogeneous integration [4][6] - The partnership is positioned to deliver a comprehensive package of intellectual property (IP), simulation tools, and advanced assembly and engineering services necessary for successful chiplet development and productization [6]

Financial Data and Key Metrics Changes - Total first quarter revenue was $4.3 million, approximately $300,000 above the midpoint of guidance, but down 28% from Q1 2024 and down 24% compared to Q4 2024 [30] - New product revenue in Q1 was $3.8 million, down 23% from Q1 2024 and down 19% compared to Q4 2024 [30] - Non-GAAP gross margin in Q1 was 45.7%, significantly lower than 71.3% in Q1 2024 and 62.9% in Q4 2024 [31] - Non-GAAP net loss was $1.1 million or $0.07 per diluted share, compared to a net income of $1.7 million or $0.12 per diluted share in Q1 2024 [32] Business Line Data and Key Metrics Changes - Mature product revenue was $600,000, down from $1.1 million in Q1 2024 and $1 million in Q4 2024 [30] - The decrease in total revenue and new product revenue was primarily due to the timing of large eFPGA IP contracts [31] Market Data and Key Metrics Changes - The defense industrial base is increasingly interested in using Intel ETNA for new designs, indicating strong market demand for eFPGA hard IP [14] - The total market for discrete FPGA devices is approximately $1.5 billion, with significant interest from the defense sector [14] Company Strategy and Development Direction - The company aims to capitalize on its unique position as the first available source for eFPGA hard IP for Intel 18A technology, focusing on integration to drive growth [10][14] - The partnership with Faraday is expected to generate production eFPGA Hard IP license revenue beginning in the second half of 2025 [16] - The company is exploring storefront opportunities and has engaged in discussions regarding potential sales of SensiML [28] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in achieving solid revenue growth, non-GAAP profitability, and positive cash flow for the full year 2025 despite a slower start [45] - The company anticipates a revenue rebound beginning in Q3, with a full-year non-GAAP gross profit margin expected to be in the low 60% range [37] Other Important Information - The company raised approximately $1.5 million from institutional investors and $1.2 million net from an ATM offering [35] - The strategic RadHard FPGA government contract is valued at approximately $6.6 million, with additional funding modifications expected [18] Q&A Session Summary Question: Can you walk us through the ramp of Intel 18A and its revenue stream? - Management indicated that the revenue stream will include both licensing and royalties, with significant interest from both defense and commercial markets [48][54] Question: What are the key drivers of revenue ramp through the year? - Key drivers include ongoing Anafuse FPGA business, the strategic RadHard contract, and new IP contracts, particularly in the second half of the year [58][60] Question: Can you provide insights on storefront opportunities? - Management highlighted several opportunities in the funnel, including government RFPs and interest from the Intel chiplet ecosystem [66] Question: How does the company plan to address the $1.5 billion FPGA market? - The company aims to reduce verification costs and integrate eFPGA into ASICs, which could lower overall costs for defense applications [70][72] Question: Are opportunities with Faraday limited to the announced node? - Management expressed interest in exploring smaller nodes, indicating potential for future collaborations beyond the current 22nm node [75]

Core Insights - Ansys has announced thermal and multiphysics signoff tool certifications for designs using Intel's 18A process technology, enhancing the reliability of advanced semiconductor systems for AI, GPUs, and HPC applications [2][8] - The collaboration between Ansys and Intel Foundry includes a comprehensive multiphysics signoff analysis flow for Intel's EMIB technology, facilitating the development of multi-die 3D integrated circuit systems [2][4] Group 1: Certification and Tools - Ansys RedHawk-SC and Totem are recognized for their speed, accuracy, and capacity in analyzing power integrity and reliability of Intel's 18A RibbonFET GAA transistors with PowerVia backside power delivery [3][8] - HFSS-IC Pro, a new addition to the HFSS-IC product family, is introduced for scalable electromagnetic analysis, certified for on-chip electromagnetic integrity in various telecommunication applications [3][8] - The qualification process for RedHawk-SC, Totem, and HFSS-IC Pro is ongoing for the Intel 18A high-performance process node, with customers able to request the latest Intel PDK for early design work [5][8] Group 2: Collaboration and Ecosystem - Ansys is joining the Intel Foundry Chiplet Alliance to develop a secure ecosystem for designing and manufacturing interoperable chiplets, enhancing multi-die assembly efficiency [6][7] - The collaboration aims to advance chiplet technology and improve the performance and integration of advanced computing systems through the EMIB-T technology, which will include through-silicon vias [4][7] - Ansys emphasizes the importance of precise tools for ensuring reliability in semiconductor systems, reinforcing its commitment to providing open-source and interoperable technology [7][8]