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MRVL's Modular Packaging Tech: Can it Transform AI Accelerators?
ZACKSยท 2025-07-10 17:26
Key Takeaways MRVL is deploying modular RDL interposer tech to build larger, high-efficiency AI accelerator solutions. The design supports HBM3/3E integration, enables die replacement, and enhances power and latency performance. MRVL sees a $94B data center chip market by 2028, with custom compute offerings witnessing a 53% CAGR.Marvell Technology (MRVL) uses advanced CMOS technologies at 5nm and 3nm nodes and is now shifting toward 2nm and below, which include innovations like gate-all-around transistors ...