Summary of Key Points from the Conference Call Industry Overview - The conference focused on the **Electronic Components Sector**, specifically discussing advancements in **Advanced Package Substrates** at the **SEMICON Japan** seminar held on December 17. Core Company Insights Ibiden - **Trend in Advanced Packaging**: Ibiden anticipates a continued trend towards larger and multi-layered substrate packaging as chiplets gain popularity. Warpage management is crucial for maintaining and improving yields [1][6]. - **Demand for Embedded Components**: There is an increasing demand from customers to embed core components like inductors and capacitors into copper clad laminates (CCLs) as substrate sizes grow [1][6]. - **Core Structure Changes**: Ibiden is considering shifting from a single core structure to a multi-core structure to enhance embedded component capabilities [1][9]. - **New Ono Plant**: Mass production is set to begin in October 2025, focusing on productivity, quality innovation, and sustainability. The plant will utilize automated processes for inspections and transport [1][9]. - **Package Size Expansion**: The demand for larger interposer reticles is increasing, driven by AI and high-performance computing (HPC) applications, which raises concerns about warpage due to coefficient of thermal expansion (CTE) mismatches [1][9]. Resonac - **Challenges with Larger Packages**: Resonac highlighted the need to address warping and crack resistance as package sizes increase due to AI and HPC demands [1][8]. - **Material Development**: The company is focused on developing materials that can withstand increased stress and improve alignment precision in larger packages [1][10]. - **Collaborative Platform JOINT3**: Launched in August 2025, this platform aims to facilitate the development of large interposers, involving 27 companies with a total project cost of ¥26 billion [1][10]. Absolics - **3D Heterogeneous Integration (3DHI)**: Absolics discussed the complexity of packaging structures and the expectation that chip configurations will evolve to include more than 10,000 bumps per mm² and 1.2 trillion transistors by 2030 [1][12]. - **Glass as a Preferred Material**: The company views glass as a leading candidate for substrate materials due to its adjustable electrical properties and CTE, despite challenges like breakage and integration difficulties [1][12]. - **Roadmap for Development**: Absolics presented a roadmap for component-embedded glass core substrates, aiming for process optimization and yield improvement by the end of 2025 [1][12]. Additional Insights - **Cutting Techniques**: Various companies are exploring laser-dicer cutting methods for glass core substrates, as traditional grinding methods become less feasible with increasing substrate thickness [2][6]. - **Industry Challenges**: The pressing process for through-holes is progressing, but stress during substrate cutting remains a significant issue [2][6]. - **Future Prototypes**: Some manufacturers are targeting mass production of glass core substrates by 2028, indicating a long-term commitment to innovation in this area [2][6]. This summary encapsulates the key points discussed during the conference, highlighting the ongoing advancements and challenges within the electronic components sector, particularly in the realm of advanced packaging technologies.