Core Viewpoint - The company has launched six new semiconductor equipment products, enhancing its capabilities in plasma etching, atomic layer deposition, and epitaxy, which supports its transformation into a high-end equipment platform company [1][4]. New Product Overview - The company introduced two new etching devices: the Primo UD-RIE for high aspect ratio etching and the Primo Menova for metal etching, both designed to improve efficiency and yield in semiconductor manufacturing [2][3]. - The Primo UD-RIE features advanced technologies such as a dynamic edge impedance adjustment system and a multi-zone temperature control system, enhancing etching precision and equipment reliability [2]. - The Primo Menova is specialized for metal etching, offering excellent etching uniformity and a high throughput, making it suitable for power semiconductors and advanced logic chips [2]. - Four new thin film deposition products were launched, including three atomic layer deposition devices and one epitaxy device, aimed at meeting the needs of advanced logic and storage devices [3][4]. - The Preforma Uniflash series for atomic layer deposition utilizes a dual-reactor design to achieve high production efficiency and excellent film uniformity [3]. - The PRIMIO Epita RP epitaxy device features a unique dual-chamber design, reducing production costs while maintaining high efficiency and adaptability for various semiconductor processes [4]. Impact on the Company - The introduction of these new products is expected to meet the increasing demand for advanced semiconductor technologies, thereby expanding the company's product offerings and enhancing its market position [4]. - The new product line is anticipated to positively influence the company's future growth in the semiconductor equipment market [4].