Core Viewpoint - The article highlights the breakthrough of Qinghe Electronics Technology in the high-end IC substrate market, which has been dominated by foreign companies, addressing the domestic reliance on imports and filling a significant gap in China's semiconductor packaging materials [1][2][4]. Group 1: Company Achievements - Qinghe Electronics Technology has successfully developed high-precision, high-reliability IC substrates, achieving automation in production and meeting international standards within a short timeframe [2][3]. - The company has established a fully automated production line capable of mass-producing high-layer substrates (20 layers) and has completed preliminary technology reserves for glass substrates [3][6]. - The high-end chip packaging substrates produced by Qinghe have already been exported to multiple countries, marking a significant step towards international market penetration [4][7]. Group 2: Industry Context - The demand for high-end IC substrates is expected to increase significantly due to advancements in AI technology and high-performance computing, with a projected market gap emerging by 2026 [4][5]. - The semiconductor industry in Shandong has historically faced challenges, but Qinghe is building a comprehensive ecosystem from talent to materials, contributing to national security supply chains [6][7]. - The company aims to transition from a follower to a leader in the industry, with aspirations for an IPO by 2028-2029, reflecting its growth and innovation strategy [7][8].