Core Viewpoint - Sifangda (300179.SZ) highlights the advantages of diamond materials, including wide bandgap, high breakdown field strength, and high thermal conductivity, making them suitable for various applications in optical windows, chip heat sinks, semiconductors, and power devices [1] Company Summary - The company has developed the capability for mass production of large-size (inch-level) diamond substrates and films [1] - The market prospects for the company's products are dependent on industry development and market conditions [1] - The company will continue to monitor market opportunities in the diamond material sector [1]

Core Viewpoint - The company has developed the capability for mass production of large-size diamond substrates and films, which can be utilized in chip heat sinks due to their high thermal conductivity [1] Group 1 - The company confirmed its ability to produce large-size (inch-level) diamond substrates and films [1] - Diamond's high thermal conductivity makes it suitable for applications in chip heat sinks and other related fields [1] - The company will continue to monitor market opportunities related to this technology [1]