格隆汇10月11日丨四方达(300179.SZ)在投资者关系活动上表示，金刚石具有禁带宽大、击穿场强高、 热导率高等优点，可用于光学窗口、芯片热沉、半导体及功率器件等领域。公司已具备批量制备大尺寸 （英寸级）金刚石衬底及薄膜的相关生产能力，产品前景由行业发展情况及市场而定，公司将持续关注 该领域的市场机会。 ...

Core Viewpoint - The company has developed the capability for mass production of large-size diamond substrates and films, which can be utilized in chip heat sinks due to their high thermal conductivity [1] Group 1 - The company confirmed its ability to produce large-size (inch-level) diamond substrates and films [1] - Diamond's high thermal conductivity makes it suitable for applications in chip heat sinks and other related fields [1] - The company will continue to monitor market opportunities related to this technology [1]