嵌入式封装技术(P2Pack)
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沪电股份:关于购买股权、专利及技术资产暨关联交易的进展公告
Zheng Quan Ri Bao· 2025-12-30 13:14
证券日报网讯 12月30日,沪电股份发布公告称,公司于2025年11月20日召开第八届董事会第十一次会 议,审议通过《关于购买股权、专利及技术资产暨关联交易的议案》,为进一步提升对胜伟策电子(江 苏)有限公司(下称"胜伟策")的控制力和经营决策效率,同意公司以19,009,050欧元的价格购买关 联方SchweizerElectronicAG.(下称"Schweizer")持有的胜伟策15%股权,本次交易完成后,公司持有胜 伟策的股权比例将由84%增加至99%。同时为进一步完善胜伟策在嵌入式封装技术(P2Pack)等领域的 技术布局,增强核心技术能力,提升产品竞争力与市场壁垒,同意胜伟策1,990,950欧元的价格向 Schweizer购买一组专利及技术资产。截至本公告日,上述交易各方均已按照约定履行完毕各自的义 务,胜伟策已办理完成上述股权变更工商备案登记手续及专利权转移变更手续。 (文章来源:证券日报) ...
沪电股份:拟1900.9万欧元购买胜伟策15%股权
Xin Lang Cai Jing· 2025-11-20 12:28
Core Viewpoint - The company aims to enhance its control and operational decision-making efficiency over Shengweica by acquiring an additional 15% stake from the related party Schweizer for €19.09 million, increasing its ownership from 84% to 99% [1] Group 1 - The acquisition of the 15% stake is part of the company's strategy to strengthen its control over Shengweica [1] - The company will also purchase a set of patents and technical assets from Schweizer for €1.9909 million to improve Shengweica's technology layout in embedded packaging technology (P2Pack) [1] - This move is expected to enhance the core technological capabilities of Shengweica, thereby increasing product competitiveness and market barriers [1]