格隆汇9月4日丨国盛智科(688558.SH)在投资者互动平台表示，半导体行业的零部件主要分为精密金属 零部件和非金属零部件，两种类型的零部件加工要求不同。精密金属零部件的加工痛点主要是：表面光 洁度/接刀痕要求高、孔系位置度要求高、加工效率要求高等方面。非金属零部件的加工痛点主要是： 材料硬度高/加工易碎裂、加工过程粉尘多等方面。公司2023年就开始为半导体行业配套精密钣焊件， 满足其精密度高、洁净度高、后处理要求高的高洁净钣金要求。2024年逐步开始针对半导体领域的数控 机床产品进行深入研发，专门开发了高速立车/高速卧加（针对半导体腔体类零件）、高速龙门（针对 半导体设备底座类零件）、摇篮五轴加工中心（叶轮类零件）、高速立加/高速卧车（针对陶瓷等非金 属类的治具）。目前已经在半导体领域头部客户实现批量应用。 ...

Core Viewpoint - The company is actively engaging in the semiconductor industry by providing precision metal components and developing advanced CNC machine tools tailored for semiconductor applications [1] Group 1: Semiconductor Component Processing - The semiconductor industry components are categorized into precision metal parts and non-metal parts, each with distinct processing challenges [1] - Precision metal parts require high surface finish, precise hole positioning, and high processing efficiency [1] - Non-metal parts face challenges such as high material hardness, fragility during processing, and significant dust generation [1] Group 2: Product Development and Applications - In 2023, the company began supplying precision sheet metal components to meet the high cleanliness and precision requirements of the semiconductor sector [1] - The company plans to deepen its research and development of CNC machine tools for the semiconductor field starting in 2024, focusing on various specialized machines [1] - Current applications include high-speed vertical and horizontal lathes for semiconductor cavity parts, high-speed gantry machines for equipment bases, cradle five-axis machining centers for impeller parts, and high-speed machines for non-metal fixtures [1] - The company has already achieved mass application with leading clients in the semiconductor field [1]