Core Viewpoint - BOE is advancing its semiconductor glass substrate business, leveraging its existing glass substrate technology from the display sector to expand into the semiconductor field [1][3]. Group 1: Business Development - BOE has recently ordered semiconductor glass substrate equipment, including automatic optical inspection (AOI) and electroless copper plating equipment [2]. - The AOI equipment will be supplied by Onto Innovation, a U.S. company, while other equipment will be sourced from domestic suppliers [3]. - The purpose of the equipment is to establish a research and development testing line for glass-based packaging technology, aimed at verifying the process technology for glass-based integrated circuit (IC) packaging substrates and achieving industrialization [3]. Group 2: Technical Advantages - Semiconductor glass substrates are smoother and thinner than traditional substrates, allowing for finer circuits and better performance in high-performance, high-integration semiconductor applications [3]. - The development of semiconductor glass substrates is challenging due to the material's properties, as even minor cracks can have significant negative impacts [3]. Group 3: Market Positioning - Industry insiders indicate that BOE's interest in the semiconductor glass substrate business has been rumored since the second half of last year, and the business is now in the equipment supplier selection phase [4]. - BOE's expertise in glass processing technology positions it favorably in the competitive landscape of semiconductor glass substrates, as it can leverage its existing supply chain advantages [3].