Core Insights - Hangzhou Weina Core Electronic Technology Co., Ltd. has completed a Series B funding round, raising over 100 million RMB, with participation from several investment firms [1][2]. Investment Details - The funding round was announced on October 29, 2025, with investors including BlueRun Ventures, SMIC Capital, Jinqiu Fund, Junke Danmu, and Shaoheng Investment [2]. - Previous funding rounds include: - A+ round on August 11, 2022, with Lenovo Ventures and Dongfang Jiafu contributing 200 million RMB [2]. - Series A round on June 5, 2022, with undisclosed amounts from DeGui Capital [2]. - Pre-A round on January 10, 2022, with Xiaomi Group and HongShan Sequoia investing tens of millions RMB [2]. - Angel round on August 22, 2021, with nearly 100 million RMB from HongShan Sequoia [2]. Company Technology Focus - Weina Core is dedicated to the research and production of world-leading AIoT SoC series chips, utilizing four core technologies: - Ultra-low power chip architecture technology to address system standby power consumption issues - Ultra-low power closed-loop adaptive near-threshold circuit technology to solve chip operational power consumption problems - Ultra-low power high-precision sensing acquisition technology to tackle high-precision and low-power sensing signal acquisition challenges - High-efficiency embedded AI engine technology to enhance computational power and energy efficiency for embedded AI applications [1][2].