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芯原股份:2025年年度业绩预告公告
Zheng Quan Ri Bao Zhi Sheng· 2026-01-23 12:25
(编辑 袁冠琳) 证券日报网讯 1月23日,芯原股份发布2025年年度业绩预告公告称,公司预计2025年度实现营业收入约 31.53亿元,较2024年度增长35.81%;预计实现归属于母公司所有者的净利润约-4.49亿元,与上年同期 相比亏损收窄1.52亿元,收窄比例为25.29%。 ...
2 Ultra-Popular AI Stocks to Sell Before They Drop 53% and 57%, According to Wall Street Analysts
The Motley Fool· 2026-01-23 09:05
Palantir Technologies - Palantir Technologies has seen its shares increase by 128% over the past year, but analysts believe the stock is overvalued, with a target price implying a 57% downside from its current price of $166 [1][8] - The company specializes in analytics platforms for commercial organizations and government agencies, boasting high retention rates due to custom workflows and a unique decision-making framework called ontology [4] - Palantir's AI platform enables clients to integrate large language models into their analytics applications, enhancing decision-making capabilities [5] - Revenue growth has accelerated for nine consecutive quarters, with Palantir noted for having the best growth and profitability in public company software [6] - Despite strong fundamentals, Palantir's shares trade at 101 times sales, the highest price-to-sales ratio in the S&P 500, raising concerns about future performance [6][7] Sandisk - Sandisk shares have increased by 1,280% over the past year, but analysts predict a 53% downside from its current price of $503.44, with a target price set at $235 [1][8] - The company designs and manufactures NAND flash-based data storage devices and benefits from a partnership with Kioxia, allowing for cost efficiencies in capital expenditures and R&D [9][10] - Sandisk has gained market share in the NAND flash market and is experiencing increased demand due to AI infrastructure, which has led to a supply shortage and price increases [11][12] - Despite projected earnings growth of 79% annually through June 2029, the current valuation of 205 times earnings is considered expensive, raising concerns about potential declines in share value [13][14]
强一股份(688809.SH):已经实现面向HBM、NOR Flash的2.5D MEMS探针卡的验证以及面向DRAM、NAND Flash的2.5D MEMS探针卡样卡研制
Ge Long Hui A P P· 2026-01-23 07:49
格隆汇1月23日丨强一股份(688809.SH)在互动平台表示,公司主要产品2D MEMS探针卡面向应用于以 SoC、CPU、GPU等为代表的非存储领域,目前公司一直在积极布局存储领域,已经实现面向HBM、 NOR Flash的2.5D MEMS探针卡的验证以及面向DRAM、NAND Flash的2.5D MEMS探针卡样卡研制。 ...
Did Nvidia Just Say "Checkmate" to Tesla?
The Motley Fool· 2026-01-23 07:00
Nvidia unveiled a new tool powering its autonomous vehicle ecosystem.For the last three years, the rise of artificial intelligence (AI) has been predominantly displayed in digital environments. Large language models (LLMs) such as ChatGPT and Gemini have transformed the software landscape.But physical applications are also emerging. Autonomous systems, particularly self-driving cars, are among the most anticipated use cases in the physical AI landscape. Tesla (TSLA +4.08%) has long expressed a vision to be ...
无锡创新平台 能释放多大能量?
Xin Hua Cai Jing· 2026-01-23 05:28
新华财经南京1月23日电(记者崔璐、杨子华、何丰伦)建成国内首条光子芯片中试线、累计孵化百余 家科技型企业、推出"5万工程"服务中小企业……近年来,江苏省无锡市与清华大学、上海交通大学、 华中科技大学等高校共建一批新型研发机构,它们一头连着实验室,一头连着生产线,推动科技创新与 产业创新深度融合,为发展新质生产力、实现高质量发展注入强劲动能。 一条孕育光子芯片产业的中试线 来到上海交通大学无锡光子芯片研究院,国内首条光子芯片中试线建设在此。2025年6月,首片6寸薄膜 铌酸锂光子芯片晶圆在中试线下线,标志着研究院构建起贯通"技术研发-工艺验证-规模量产"的全链条 能力,更构建起支撑光量子计算产业化落地的核心基础设施。 "光子芯片是解决当前AI时代算力供给不足的重要载体。基于这条中试线,我们已突破光量子计算在芯 片化、集成化的主要瓶颈,并赋能金融科技、生物医药、人工智能等领域产业落地,提供指数级算力。 目前,这条中试线预计年产能达1.2万片晶圆,并入选首批工信部重点培育中试平台。"研究院相关负责 人付攀表示。 这条中试线不只是一条生产线,更是一个光子芯片产业生态的孵化器。 "实验室的成果到实现产业化还有一段距离 ...
AI硬件板块延续回调,半导体设备ETF易方达(159558)半日净申购超3000万份
Sou Hu Cai Jing· 2026-01-23 05:10
Group 1 - The AI hardware sector, including CPO, GPU, and memory components, continues to experience a pullback [1] - The CSI Cloud Computing and Big Data Theme Index increased by 0.8%, while the CSI Chip Industry Index decreased by 1.4%, and the CSI Semiconductor Materials and Equipment Theme Index fell by 1.0% [1] - Despite the overall market trends, there is a significant inflow of funds into the semiconductor equipment ETF, E Fund (159558), with over 30 million units net subscribed in half a day [1] - The E Fund semiconductor equipment ETF has seen net inflows for 18 consecutive trading days, totaling over 2.5 billion yuan [1]
未知机构:大摩闭门会DeepSeek新模型解读260121-20260123
未知机构· 2026-01-23 02:10
大摩闭门会:DeepSeek新模型解读 260121_导读 2026年01月22日 20:52 关键词 ngram混合架构 HBM 条件内存 DRAM 推理能力 GPU 多模态 开源 硬件限制 效率驱动 追赶美国 战略意义 WACC beta 市场风险溢价 永续增长率 超预期 低于预期 半导体 全文摘要 中国的人工智能公司通过创新的混合架构和模块,如n-gram,实现了大模型推理的高效执行,降低了基础设施成 本,推动了本地AI发展并提升了全球竞争力。n-gram模块的核心创新在于通过存储和计算分离,有效缓解AI计算瓶 颈,减少了对高带宽内存(HBM)的依赖,同时降低了整体基础设施成本,从而在推理能力和成本方面取得显著 提升。下一代模型继续利用n-gram架构,进一步提升了编码及逻辑推理能力。 大摩闭门会:DeepSeek新模型解读 260121_导读 关键词 ngram混合架构 HBM 条件内存 DRAM 推理能力 GPU 多模态 开源 硬件限制 效率驱动 追赶美国 战略意义 WACC beta 市场风险溢价 永续增长率 超预期 低于预期 半导体 全文摘要 中国的人工智能公司通过创新的混合架构和模块,如n-g ...
英集芯1月22日获融资买入6502.83万元,融资余额2.80亿元
Xin Lang Cai Jing· 2026-01-23 01:52
机构持仓方面,截止2025年9月30日,英集芯十大流通股东中,香港中央结算有限公司位居第七大流通 股东,持股332.07万股,相比上期增加61.41万股。 1月22日,英集芯跌3.98%,成交额5.44亿元。两融数据显示,当日英集芯获融资买入额6502.83万元, 融资偿还4836.32万元,融资净买入1666.52万元。截至1月22日,英集芯融资融券余额合计2.81亿元。 融资方面,英集芯当日融资买入6502.83万元。当前融资余额2.80亿元,占流通市值的2.55%,融资余额 超过近一年80%分位水平,处于高位。 融券方面,英集芯1月22日融券偿还4900.00股,融券卖出2.69万股,按当日收盘价计算,卖出金额68.03 万元;融券余量5.14万股,融券余额130.02万元,超过近一年90%分位水平,处于高位。 资料显示,深圳英集芯科技股份有限公司位于广东省珠海市香洲区唐家湾镇港湾1号港7栋三楼,成立日 期2014年11月20日,上市日期2022年4月19日,公司主营业务涉及电源管理、快充协议芯片的研发和销 售。主营业务收入构成为:电源管理类65.15%,数模混合SoC类22.02%,电池管理类12.3 ...
复旦团队研制出“纤维芯片”,芯片ETF天弘(159310)昨日获净申购200万份,电子ETF(159997)昨日成交额超4000万元
2 1 Shi Ji Jing Ji Bao Dao· 2026-01-23 01:47
Group 1 - The market experienced a rebound on January 22, with all three major indices turning positive, and the ChiNext index showing strong performance [1] - The Chip ETF Tianhong (159310) recorded a trading volume exceeding 27 million yuan, with a net subscription of 2 million shares, driven by leading stocks such as Longxin Technology and Chipone Technology [1] - The Electronic ETF (159997) had a trading volume over 40 million yuan, with stocks like Pengding Holdings and China Great Wall leading the gains [1] Group 2 - The Tianhong Chip ETF tracks the CSI Chip Industry Index, which is expected to see a 37.62% year-on-year growth in net profit attributable to shareholders in the first half of 2025, supported by policy and demand [1] - The Electronic ETF focuses on the semiconductor, consumer electronics, and AI chip sectors, providing exposure to leading companies in the digital economy's "hard technology" investment opportunities [1] - The Ministry of Industry and Information Technology announced plans to accelerate the high-quality development of the AI industry, emphasizing technological innovation and breakthroughs in key technologies such as training chips and heterogeneous computing power [1] Group 3 - A research team from Fudan University has developed "fiber chips," which are expected to provide critical support for future industries like brain-machine interfaces [2] - The global AI industry is shifting from model training to inference, with domestic cloud vendors' AI computing power center construction plans expected to drive demand for high-performance chips [2] - AI is increasingly penetrating traditional consumer electronics such as smartphones, PCs, and wearable devices, along with innovative AI hardware like AI glasses and toys, which will boost both volume and price of core components like SOC chips [2]
阿里巴巴-W高开近4% 消息称其旗下芯片公司平头哥拟独立上市
Zhi Tong Cai Jing· 2026-01-23 01:31
阿里巴巴-W(09988)高开近4%,截至发稿,涨3.88%,报171.2港元,成交额8.11亿港元。 消息面上,据媒体援引知情人士报道,阿里巴巴正准备推进旗下AI芯片制造企业"平头哥"(T-Head)独立 上市。阿里计划将其重组为一个部分由员工持股的业务实体,随后再寻求进行首次公开募股(IPO),但 具体上市时间尚未确定,该行动仍处于准备阶段。据悉,平头哥是阿里巴巴于2018年成立的半导体芯片 公司,由阿里集团从收购的中天微系统及阿里达摩院内部芯片团队整合而来,重点聚焦AI芯片与RISC- V生态技术。 截至目前,平头哥在算力芯片领域推出AI推理芯片含光800、CPU倚天710以及AI芯片PPU,在存储芯片 领域推出SSD主控芯片镇岳510,在网络芯片领域据称也将推出相关芯片,已布局数据中心全栈芯片。 平头哥还在端侧芯片推出羽阵IoT芯片,已实现数亿出货,布局覆盖云端和终端。 ...