产耗时近5年，我们突破了多个'无人区'技术难题。"墨睿科技高级技术经理梁惠明表示，"获奖后，我们将借助大赛资源进一步提升品牌影响力，加速规模 化发展。" 广东清大创新研究院院长、东莞市国际技术转移中心主任邬新国作为主办方代表，介绍了大赛的亮点与成果。他指出，本届大赛充分发挥了清华体系的资源 优势和国际技术转移网络，成功引入了一批国际化项目，同时紧扣大湾区产业特色，聚焦电子信息与生物医药领域，展现了新材料技术的多元化突破。 经过激烈角逐，大赛最终评选出企业组和创业组的一、二、三等奖及优胜奖。其中，墨睿科技凭借"石墨烯导热垫"项目引发关注，该项目也获评本次大赛的 企业组二等奖。"石墨烯导热垫"解决了高功率芯片散热的技术瓶颈，已成功应用于算力芯片、数据交换机等领域，市场需求呈现爆发式增长。"从研发到量 7月17日，第九届"创客广东"新材料中小企业创新创业大赛决赛暨颁奖仪式在东莞松山湖天安云谷举办。本次大赛由广东省工业和信息化厅指导，东莞市清 大技术转移中心主办，汇聚了来自省内外、港澳台及海外的优质新材料项目同台竞技，涵盖半导体芯片材料、石墨烯材料等多个前沿领域，最终评选出企业 组、创业组各级奖项。 东莞市工业和信息 ...

Core Viewpoint - The article discusses the challenges posed by high-power AI chips, particularly focusing on heat generation and warping issues due to increased power density and chip size, emphasizing the need for efficient thermal interface materials (TIM) to ensure stable and effective operation of AI chips [1][3]. Group 1: High-Power AI Chip Challenges - The rapid development of data centers centered around high-performance AI chips has led to a significant increase in power consumption, exemplified by the H100 chip with a maximum power of 700W and a size of 814mm² [1]. - The reliability of chips decreases by approximately 50% for every 10°C increase in temperature, highlighting the critical importance of effective heat dissipation [1]. Group 2: Thermal Interface Materials (TIM) - Different levels of TIM are categorized, including TIM1.5 (direct connection between bare chip and heat sink), TIM1 (between chip and lid), and TIM2 (between lid and heat sink) [2]. - TIM for high-power large-size chips must meet specific requirements: low bond line thickness (≤0.3mm), low thermal resistance (≤0.1℃cm²/W), and stress absorption to counteract warping [3]. Group 3: Solutions by Hongfu Cheng - Hongfu Cheng has developed a vertical graphene thermal pad that addresses the challenges of heat dissipation for high-power large-size chips, leveraging their experience in oriented carbon fiber thermal pads [4][8]. - The vertical graphene thermal pad achieves a low thermal resistance of 0.04℃cm²/W through orientation technology and appropriate packaging pressure [5]. - The internal porous structure of the thermal pad allows it to adapt quickly to local deformations, preventing material from being pushed out and ensuring long-term reliability [6]. Group 4: Performance Advantages - Compared to traditional thermal interface materials like thermal grease and indium sheets, the graphene thermal pad does not suffer from creep or pump-out risks, maintains a complete thermal interface, and provides uniform heat conduction without hotspots [11]. - The manufacturing process for the graphene thermal pad is simpler and allows for automated assembly, significantly reducing packaging time and equipment costs compared to indium sheets [11]. Group 5: Reliability and Commercialization - The graphene thermal pads have undergone rigorous testing, showing a thermal resistance change rate of less than 5% after 1000 hours of high-temperature and thermal cycling tests, indicating superior reliability compared to conventional materials [7]. - Hongfu Cheng has established automated production lines and achieved mass delivery, gaining recognition from leading companies in the chip industry for product quality [8].