Core Insights - Harbin Institute of Technology (Shenzhen) has developed an innovative composite structure of nano copper paste and three-dimensional porous copper, breaking through technical barriers in electronic packaging [1][3]. Group 1: Technical Advancements - The new nano copper paste is the first self-reducing nano copper paste that can be sintered in air, addressing the industry challenge of oxidation during sintering [3]. - The three-dimensional porous copper developed by the team has a Young's modulus that is 80% lower than traditional solder, allowing for effective expansion and contraction during temperature changes, thereby alleviating thermal stress [4]. - The thermal conductivity of the new structure is 300% higher than that of traditional solder, enabling rapid heat dissipation from chips, ensuring stable operation in high-temperature environments [4]. Group 2: Performance Improvements - The composite structure achieves the goal of "low-temperature connection and high-temperature service," with a service temperature increase of over 300°C compared to traditional solder [4]. - In thermal cycling life tests, the new structure shows more than three times the reliability compared to the best-performing sintered copper, fundamentally addressing issues of thermal expansion coefficient mismatch and thermal fatigue [4]. Group 3: Market Applications - The innovative structure has broad application prospects in fields such as photovoltaics, consumer electronics, and new energy vehicles [5]. - The products developed by the team have received certification from the Aerospace Science and Industry Corporation, providing strong support for enhancing the core competitiveness of domestic power devices [5].