Core Viewpoint - The company, 科建高分子材料 (Shanghai) Co., Ltd., has decided to change its stock issuance application from the Shenzhen Stock Exchange's ChiNext to the Beijing Stock Exchange, reflecting its strategic considerations and current market conditions [1] Group 1 - The company held its third board meeting on July 14, 2025, and the third extraordinary shareholders' meeting on July 29, 2025, where the proposal to apply for public stock issuance and listing on the Beijing Stock Exchange was approved [1] - The company submitted a change of guidance record to the Shanghai Securities Regulatory Bureau on July 29, 2025, through its advisory institution, Changjiang Securities [1] - The Shanghai Securities Regulatory Bureau approved the change application on July 30, 2025 [1] Group 2 - The company specializes in the research, production, and sales of sealing, bonding, damping, and noise reduction materials [1] - It is recognized as a national-level specialized and innovative "little giant" enterprise [1]