Core Viewpoint - The company has established technical expertise in high-frequency and high-speed boards, packaging substrates, and high-layer multilayer boards, and is preparing for the 6G era with hardware and manufacturing process development [1] Group 1: Technical Capabilities - The company has accumulated technology in high-frequency and high-speed boards, packaging substrates, and high-layer multilayer boards [1] - The company has already served clients in the 5G communication equipment sector [1] Group 2: Future Development - The company plans to leverage its IPDM (Integrated Product Development and Manufacturing) capabilities to provide one-stop IPDM solutions for various scenarios in the high-speed interconnect communication field [1]