Core Viewpoint - Guangdong Wei's New Materials Co., Ltd. has applied for a patent for a high-silicon content, large particle size polysiloxane polycarbonate resin, indicating a focus on advanced materials for various industries, including automotive and aerospace [1] Group 1: Patent Details - The patent application is titled "A high-silicon content, large particle size polysiloxane polycarbonate resin and its preparation method and application" with publication number CN121554722A, filed on January 2026 [1] - The resin consists of bisphenol A-based polycarbonate segments chemically bonded to phenolic hydroxyl-terminated polysiloxane, achieving a silicon content of 20-30 wt% [1] - The average particle size of the silicon clusters formed in the bisphenol A-based polycarbonate matrix is between 1-5 μm, with a particle size distribution index of less than 1.3 [1] Group 2: Performance and Applications - The resin exhibits a notch impact strength of over 70 KJ/m² at -40°C while maintaining excellent high-strength performance at room temperature [1] - Potential applications for this resin include the automotive industry, new energy vehicles, photovoltaic fields, and aerospace products that require low-temperature and weather resistance [1]