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中关村新增三个芯片共性技术服务平台
Bei Jing Ri Bao Ke Hu Duan· 2025-08-17 20:46
Core Viewpoint - The launch of three service platforms in the IC PARK aims to address the testing shortcomings in the integrated circuit field in Beijing and the surrounding Jing-Jin-Ji region, enhancing the efficiency of chip design and development processes [1] Group 1: Service Platforms - The three newly launched service platforms include a high-speed signal testing laboratory, a high-end advanced packaging technology service center, and a power cycling and transient thermal testing laboratory, all focusing on common technologies in the chip sector [1] - The high-speed signal testing laboratory specifically targets applications in satellite communication, automotive navigation, and data center high-speed interconnects, making it one of the few laboratories in the market with systematic testing capabilities [1] Group 2: Industry Impact - The increasing data volume and the corresponding demand for faster chip data processing speeds highlight the importance of testing chip information transmission speeds during the research and development process [1] - Previously, many small and medium-sized enterprises in Beijing had to send chips to southern regions for testing, which incurred costs and delayed the R&D process by several days; the new laboratory significantly improves R&D efficiency by allowing local testing [1] - The primary investment in chip design R&D is in human resources, and by saving time in the development process, the new facilities help companies reduce costs [1]