消息面上，小摩此前发布研报指出，基于先进逻辑封装领域强劲的资本支出趋势，以及主流外包半导体 封装测试(OSAT)市场出现初步改善迹象，该行将ASMPT列入正面催化剂观察名单。同时，该行将公司 2026及27财年每股盈利预测分别上调7%及15%。 小摩预计，ASMPT将上调其热压焊接(TCB)设备的长期总潜在市场规模预期，并对于在该市场获得更多 市场份额展现信心。同时，公司将提供更多在高频宽记忆体(HBM)热压焊接市场的进展，并指出中国市 场及主流外包半导体封装测试厂商的资本开支环境正变得更加有利。 ASMPT(00522)涨超5%，截至发稿，涨5.53%，报110.7港元，成交额8948.97万港元。 ...

Core Viewpoint - Morgan Stanley upgraded ASMPT (00522) rating from "Neutral" to "Overweight" and raised the target price from HKD 76 to HKD 125, citing strong capital expenditure trends in advanced logic packaging and initial signs of improvement in the mainstream outsourced semiconductor assembly and test (OSAT) market [1] Group 1 - The company’s earnings per share forecasts for fiscal years 2026 and 2027 were increased by 7% and 15% respectively [1] - ASMPT is expected to raise its long-term total addressable market size for thermal compression bonding (TCB) equipment and is confident in gaining more market share in this area [1] - The company will provide updates on its progress in the high bandwidth memory (HBM) thermal compression bonding market, noting that the capital expenditure environment in China and among mainstream OSAT providers is becoming more favorable [1]