Investment Highlights - Infineon announced progress in its scalable GaN manufacturing technology based on 300mm wafers, with the first samples expected to be delivered to customers in Q4 2025, aiming to strengthen its position as a market leader in GaN [1][2] - Chipsea Technology has recently completed the tape-out of its first high-performance, high-reliability automotive MCU product, which meets ASIL-D safety standards [2] - Nanfu Technology has secured several million yuan in Pre-A round financing, which will be used to expand its high-frequency, high-speed copper-clad laminate production line and enhance product development in aerospace, communications, automotive, and data center sectors [2] - Xiamen Silan Microelectronics has made significant progress on its 8-inch silicon carbide power device chip manufacturing line, with the first equipment arriving ahead of schedule [2] - China Mobile has announced a procurement project for AI servers, estimating a total of 7,058 units to be purchased for the period of 2025 to 2026 [2] - AGC, a Japanese materials giant, has been forced to suspend the supply of a specific CMP polishing liquid due to new export control policies in Taiwan, which is critical for advanced chip manufacturing [2] - Samsung Electronics has reduced the production of its 12-layer HBM3E memory, originally planned for supply to NVIDIA, due to delays in negotiations and increased uncertainty in demand for the second half of the year [2] Company Announcements - Raytheon Technology announced the establishment of a smart glasses company, holding a 35% stake to enhance competitiveness in the smart glasses market [3] - Fenghua Advanced Technology announced a cash dividend of 1.50 yuan per 10 shares, totaling approximately 172.12 million yuan [3] - Tonglian Precision announced a cash dividend of 1.50 yuan per 10 shares, amounting to approximately 23.51 million yuan [3] - Zhongwei Company announced a cash dividend of 0.30 yuan per share, totaling approximately 187.21 million yuan [3] - Tianwei Vision announced a cash dividend of 0.50 yuan per 10 shares, based on a total share capital of approximately 802.56 million shares [3] - Dashi Intelligent signed a contract for an intelligent project worth 11.88 million yuan, providing IoT and AI-based solutions [3] - Yongxi Electronics announced a share buyback progress, with a total of 2.56 million shares repurchased, representing 0.63% of total shares [3] - Keda Automation plans to acquire 51% of Haituo Technology for 209.10 million yuan in cash [3] - Weichuang Optoelectronics announced a delay in its smart transportation project, now expected to be operational by December 31, 2025 [3] - Jinfeng Technology received an administrative penalty for accounting errors that inflated revenue in previous reports, resulting in a warning and a fine of 4 million yuan [3] - Juquan Technology announced a change in core technical personnel, with Xuming Zhang resigning from multiple positions but continuing as a technical advisor [3]