ASMPT Conference Call Summary Company Overview - **Company**: ASMPT - **Industry**: Semiconductor and Advanced Packaging Key Points and Arguments TCB and Advanced Packaging Developments - ASMPT has installed over 500 TCB (Thermal Compression Bonding) devices globally, with significant progress in the storage sector, particularly with the XPM31 device entering high-volume production and 12-layer HBM4 devices in low-volume production [2][3][5] - The company is collaborating with clients on no flux TCB trials, indicating innovation in packaging technology [3][5] - A new generation HP Hadoop product is set to launch in Q3 2025, enhancing competitiveness in Hybrid Bonding [2][5] - Orders for systems exceeding 800G in Photonics and CPO (Co-Packaged Optics) technology have been secured, with expectations for large-scale production in the next two to three years [2][5] Market Demand and Performance - The growth of AI data centers is driving demand for efficient power management, leading to increased needs for wire bonding, die bonding, and SMT (Surface Mount Technology) placement tools [2][6][11] - In H1 2025, SMT business benefited from rising orders in consumer electronics and electric vehicles (EVs) in China, contributing significantly to overall performance [2][7] - Supply chain diversification has led to orders from EMS companies and local firms in India, primarily for mobile applications, resulting in a notable rebound in SMT business in Q1 [2][7] Financial Performance and Projections - ASMPT's performance in H1 2025 was strong, with new orders exceeding expectations and continued leadership in the PCB sector [3][7] - The company anticipates a slight decline in bookings for Q3 but expects a year-over-year increase in double digits [8] - HBM4 demand is projected to grow in H2 2025, with a target of achieving $100 million in revenue by 2027, capturing 35-40% market share [4][19][20] Industry Trends and Challenges - The automotive and industrial control sectors are currently experiencing weak demand, with contributions dropping significantly compared to the previous year [10][28] - Domestic market indicators show signs of recovery, with increased usage of OSET services and rising PCB production reflecting a positive industry outlook [12][28] - The relationship between SMT and SEMI markets is cyclical, with SMT expected to rebound following SEMI market recoveries [9] Technology and Equipment Insights - The delivery time for equipment, including TCB, is typically around six months, with adjustments made for large orders [21] - The second-generation Hyperbonding equipment shows improvements in bonding accuracy, speed, and footprint, enhancing competitiveness [26] - Advanced packaging revenue growth is expected from technologies like Photonics and high-bandwidth transceivers, driven by AI data center demand [27] Conclusion - ASMPT is positioned well within the semiconductor and advanced packaging industry, with strong growth prospects driven by AI and domestic market demands, despite challenges in certain sectors. The company is focused on innovation and maintaining a competitive edge through new product launches and strategic collaborations.