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华为展示 eFlash 的替代方案,VLSI 2025亮点曝光
半导体行业观察· 2025-04-23 01:58
Core Viewpoint - The 45th VLSI Technology and Circuits Symposium will be held in Kyoto, Japan, from June 8 to 12, 2025, focusing on the theme of cultivating a garden of ultra-large-scale integrated circuits, aiming to drive the global transition to a new era of smart interconnected devices and systems [1][2]. Group 1: Conference Overview - The VLSI 2025 symposium accepted a total of 251 regular papers, including 1 Late News paper, with contributions from various countries, highlighting the global participation in advanced technology discussions [2]. - The United States led with 57 accepted papers, followed by South Korea with 54, and mainland China with 52, indicating a strong representation from these regions [2]. Group 2: Key Technological Innovations - Intel will present its 18A platform technology, which claims a 25% performance improvement and a 36% reduction in power consumption compared to its previous 3 technology at the same voltage and complexity [4][5]. - TSMC demonstrated advancements in high-density wafer-level connections and new device processes, showcasing innovations in CMOS scaling and materials [7][9]. Group 3: Storage Technology Developments - Samsung introduced its 9th generation 3D NAND flash memory with 286 layers, achieving a 50% increase in bit density compared to the previous generation [15]. - Huawei showcased a high-performance 1T1C 3D FeRAM chip, which operates at high temperatures and demonstrates significant data retention capabilities, positioning it as a potential alternative to eFlash in embedded non-volatile memory applications [17]. Group 4: Image Sensor Innovations - Sony presented a back-illuminated SPAD depth sensor with a peak detection efficiency (PDE) of 42.5% at a wavelength of 940 nm, marking a significant advancement in sensor technology [25]. - Canon introduced a SPAD image sensor for automotive applications, featuring a dynamic range of 156 dB and capabilities for low-light image capture [30]. Group 5: Future Directions and Challenges - Experts from major companies like SK Hynix and NVIDIA discussed the future of DRAM technology and the need for innovation in VLSI to meet the demands of AI and high-performance computing [61][62]. - The symposium highlighted the importance of sustainable development in semiconductor technology, addressing the challenges posed by the rapid evolution of artificial intelligence and its impact on the industry [63].