Core Points - Lege Ergonomics Technology Co., Ltd. has completed the issuance of "25 Lege Shares MTN001 (Sci-Tech Bond)" on November 5, raising funds of 250 million yuan [2] - The bond is the first phase of the company's 2025 Sci-Tech Innovation Bonds, with a term of 546 days, a coupon rate of 2.59%, and a face value of 100 yuan [2] - The company aims to issue a total of up to 800 million yuan in medium-term notes to optimize its debt structure and enhance financial flexibility [2] Financial Details - The bond's issuance date is November 5, 2025, and the maturity date is May 5, 2027 [2] - The bond was managed and underwritten by Zheshang Bank Co., Ltd. [2] - The company received a registration notice from the China Interbank Market Dealers Association, valid for two years [2] Strategic Intent - The issuance of the Sci-Tech Innovation Bond is intended to support the company's long-term development strategy and broaden financing channels [2] - The company aims to acquire funding at a lower cost and enhance operational resilience and growth potential [2] - The initiative is expected to have no adverse impact on daily operations or shareholder interests, maintaining business independence [2]