Group 1 - The company has approved the issuance of various types of debt financing instruments for 2025, including corporate bonds, short-term financing bonds, and perpetual bonds, among others [1] - The company completed the issuance of its fourth phase of technology innovation bonds for 2025, raising 700 million RMB with a maturity of 269 days and an interest rate of 2.70% [2] - The funds raised from the bond issuance will be used to repay the company's interest-bearing liabilities [2]